United Silicon Carbide, Inc.
Radiation-hardened silicon carbide (SiC) JFET cascode switches for exploding foil initiators
- Sector
- Semiconductors
- Headquarters
- MONMOUTH JUNCTION, NJ
- Latest Form D
- $2M, Jul 2016
- Total capital
- $34.4M
- Federal grants
- $434K
- 3 awards · 2015–2018
- Rank in peer group#28 of 49
- Private capital raised
- $3M
- 2 Form D · last Jul 2016
- 123 months since last filing
- Federal contracts
- $31M
- 23 awards · Defense, NASA
- Rank in Semiconductors#10 of 707
- Granted patents
- 26
- 14 pending · first 2014
- Rank in peer group#2 of 49
Capital timeline
Latest events
- Federal grantDefense · Phase I · High Power Solid State Electronic Switch for Use in Exploding Foil Initiator Applications$125K
- Federal contractNASA · Igf::ot::igf NASA Needs Efficient, Low Mass, Low Volume Power Electronics For A Wide Variety Of Applications And Missions. Silicon Carbide (sic) Switches Provide Fast, Low Loss Switching, Low On-resistance And High Breakdown Voltage To Potentially Meet This Need. Gate Drivers Are A Key Component To Fully Realize The System Level Advantages That Sic Power Switches Can Provide. By Implementing Gate Drivers In Sic, They Can Tolerate Extreme Temperatures (500 Deg. C) Allowing Them To Be Collocated $124K
- Private capital raisedForm D · SEC · 2nd filing$2M
- Federal contractDefense · Igf::ot::igf 6500V-100A Sic Jfet-based Half-bridge Module (N161-066-0533)$80K
- Federal grantEnergy · Phase I · High Current SiC Cascodes for Electric Drive Vehicle Power Electronics$155K
- Federal contractNASA · Igf::ot::igf Radiation Tolerant, Extreme Temperature Capable Electronics Are Needed For A Variety Of Planned NASA Missions. For Example, Insitu Exploration Of Venus And Long Duration Europa-jupiter Missions Will Expose Electronics To Temperatures Up To 500 ?c And Radiation Of 3 Mrad (si) Total Dose. During This Program, United Silicon Carbide Will Extend The Capability Of Its Sic Jfet Integrated Circuit (ic) Fabrication Technology To Produce Electronics Compatible With Such Extreme Environments.$750K
- Federal contractNASA · Igf::ot::igf Radiation Tolerant, Extreme Temperature Capable Electronics Are Needed For A Variety Of Planned NASA Missions. For Example, In-situ Exploration Of Venus And Long Duration Europa-jupiter Missions Will Expose Electronics To Temperatures Up To 500 Deg.c And Radiation Of 3 Mrad (si) Total Dose. During This Program, United Silicon Carbide Will Extend The Capability Of Its Sic Jfet Integrated Circuit Fabrication Technology To Produce Electronics Compatible With Such Extreme Environments. $124K
- Private capital raisedForm D · SEC · 1st filing$1M
Show 20 earlier federal awards
- Federal grantEnergy · Phase I · High Current SiC Schottky Diodes for Electric Drive Vehicle Power Electronics$155K
- Federal contractDefense · Igf::ot::igf SBIR II Scalable Wide Bandgap Integrated Technology$750K
- Federal contractNASA · Igf::ot::igf Solar-blind Ultraviolet (uv) Imaging Is Needed In The Fields Of Astronomy, National Defense, And Biochemistry. United Silicon Carbide, Inc. Proposes To Develop A Monolithic, Solar-blind Uv Image Sensor With 320 X 256 Pixels On A 25 Micron Pitch With A Frame Rate Of 50 Frames Per Second And Pixel Fill Factor Over 80%. A Silicon Carbide (sic) Integrated Circuit Technology That Is Compatible With Production In Commercial Silicon Fabs Will Be Used To Fabricate The Sensors. Sic Is An Id$745K
- Federal contractDefense · Igf::ot::igf Silicon Carbide Vertical Jfet Power Electronics For Mea$20.7M
- Federal contractDefense · Igf::ot::igf Scalable Wide Bandgap Integrated Circuit Technology$150K
- Federal contractNASA · Igf::ot::igf Solar-blind Ultraviolet (uv) Imaging Is Critically Important In The Fields Of Space Astronomy, National Defense, And Bio-chemistry. United Silicon Carbide, Inc. Proposes To Develop And Commercialize A Unique Jfet-based Monolithically-integrated Radiation-tolerant Solar Blind Active Pixel Sensor (aps) Uv Imager. Silicon Carbide Is The Ideal Materials System Due To Its Negligible Dark Currents, Excellent Radiation Tolerance, Intrinsic Insensitivity To Visible And Near IR Light, And T$125K
- Federal contractNASA · Igf::ot::igf United Silicon Carbide, Inc. Proposes To Develop A Novel Compact, Efficient And High-temperature Power Module, Based On Unique Co-packaging Approach Of Normally-off Silicon (si) Mosfet With Silicon Carbide (sic) Normally-on Power Jfet In A Cascode Configuration. A Much Desired Silicon Mos Gate Control Is Provided Readily Compatible With The Conventional Gate Drivers, Making A Proposed Module A Plug-in Replacement For Conventional Si Igbt Modules Offering Smaller Size And Higher Pow$124K
- Federal contractDefense · SBIR Phase 1, Topic # OSD11-EP1$150K
- Federal contractNASA · This Small Business Innovation Research Phase I Project Will Address The Needs Of Space Astronomy, Military Threat Detection, And Scientific Research For Image Sensors That Are Sensitive In The Ultraviolet While Insensitive In The Visible Spectrum. This Is Because Solar Illuminated Backgrounds Are Orders Of Magnitude Greater Than The Ultraviolet Radiation Of Interest (solar Blocking Filters Exhibit Low Uv Transmission And Scattered Light). This Program Will Develop Monolithic Imaging Arrays Made$125K
- Federal contractDefense · Phase II SBIR To United Silicon Carbide For Topic # A10-132, Titled "high Temperature Silicone Carbide Gate Driver".$728K
- Federal contractDefense · Phase I SBIR$120K
- Federal contractDefense · Mda SBIR Phase 2$699K
- Federal contractDefense · Ph I Research & Development$100K
- Federal contractNASA · Three Linear Array Detectors$49K
- Federal contractDefense · Basic Effort SBIR Phase I$100K
- Federal contractDefense · SBIR I$100K
- Federal contractDefense · A Novel Approach To Packaging High-power And High-temperature Sic Modules For Double-sided Cooling$750K
- Federal contractDefense · Reliable, High Temperature Silicon Carbide Mosfet.$730K
- Federal contractDefense · Basic$750K
- Federal contractDefense · 200511!009147!2100!W56HZV!TACOM - Warren !W56HZV05C0544 !a!n! !y! ! !20050803!20070915!042068101!042068101!042068101!N!UNITED Silicon Carbide Inc !100 Jersey Ave !new Brunswick !NJ!08901!07690!035!34!BRIDGEWATER !somerset !new JERSEY!+000000150000!N!N!000000000000!AC42!RDTE/TANK - Automotive-applied Research !S1 !services !000 !* !221122!E! !3! ! ! ! ! !202$2.9M
Node area is scaled to amount. Form D reports securities sold, which can differ from an announced round; filings are numbered in the order they were made.
Federal first
111months
from United Silicon Carbide, Inc.’s first federal award to its first private round.
- First federal award · Aug 2005
- Defense · $2.9M
- First Form D · Nov 2014
- $1M · 1st Form D
- Awards before first raise
- 19 awards
An association in public records, not a cause or a prediction.
Standing among 49 peers
Line = medianSemiconductors · Device
- Federal grantsBelow median
- Granted patents#2 · top 4%
- Linked publications#3 · top 6%
Cumulative measures favor older companies. Rankings describe position today, not outcome. Below the median, ranks show as a band rather than a number.
Founders and team
Researcher links verified by same-company patents and grants- Anup Christopher BhallaResearcherExecutive OfficerLinked by 5 patents
- Betsy Christopher CottonExecutive OfficerNamed in SEC Form D filings
- Derek Christopher LidowDirectorNamed in SEC Form D filings
- Greg Christopher OlsenDirectorNamed in SEC Form D filings
- J. Christopher DriesExecutive Officer, DirectorNamed in SEC Form D filings
- Mari-Anne Christopher GagliardiExecutive OfficerNamed in SEC Form D filings
Show all 7 people
- Marshall Christopher CohenExecutive Officer, DirectorNamed in SEC Form D filings
What it has protected
USPTO · 26 granted of 40- GrantedPower Block Based On Top-side Cool Surface-mount Discrete Devices With Double-sided Heat SinkingUSPTOUS 12,653,029
- PendingDual Gate Cascode DriveUSPTOApplication 18706401
- GrantedVoltage-source Gate Drive Having Shunt Capacitors And Shunt ResistorsUSPTOUS 12,334,917
Show all 40 patent records
- Power Block Based On Top-side Cool Surface-mount Discrete Devices With Double-sided Heat SinkingJun 9, 2026 · US 12,653,029Granted
- Dual Gate Cascode DriveJun 4, 2026 · Application 18706401Pending
- Voltage-source Gate Drive Having Shunt Capacitors And Shunt ResistorsJun 17, 2025 · US 12,334,917Granted
- Vertical Junction Field-effect Transistors With Source-drain Diode Cells Integrated At Die LevelDec 19, 2024 · Application 18742386Pending
- Transistor With Integrated Source-drain DiodeJul 4, 2024 · Application 18533355Pending
- Reusable Wide Bandgap Semiconductor SubstrateJul 25, 2023 · US 11,710,662Granted
- Double-sided Chip Stack AssemblyDec 28, 2021 · US 11,211,373Granted
- Reusable Wide Bandgap Semiconductor SubstrateNov 3, 2020 · US 10,825,733Granted
- Series-connected Fets In Active Linear ModeJun 2, 2020 · US 10,673,396Granted
- Planar Multi-implanted JFETOct 15, 2019 · US 10,446,695Granted
- Trench Vertical JFET With Improved Threshold Voltage ControlAug 27, 2019 · US 10,396,215Granted
- Trench Vertical JFET With Ladder TerminationJul 30, 2019 · US 10,367,099Granted
- Vertical JFET Made Using A Reduced Masked SetJul 30, 2019 · US 10,367,098Granted
- Tunneling Field Effect TransistorDec 4, 2018 · US 10,147,813Granted
- Planar Triple-implanted JfetNov 6, 2018 · US 10,121,907Granted
- Vertical Jfet Made Using A Reduced Mask SetAug 21, 2018 · US 10,056,500Granted
- Trench Vertical JFET With Ladder TerminationAug 14, 2018 · US 10,050,154Granted
- Perimeter Control Of Crack Propagation In Semiconductor WafersApr 12, 2018 · Application 15730834Pending
- High Voltage Switch ModuleJan 9, 2018 · US 9,866,213Granted
- Hybrid Wide-bandgap Semiconductor Bipolar SwitchesAug 1, 2017 · US 9,721,944Granted
- Self-aligned Shielded-gate Trench Mos-controlled Silicon Carbide Switch With Reduced Miller Capacitance And Method Of Manufacturing The SameJul 27, 2017 · Application 15329086Pending
- Offset Leadframe Cascode PackageJul 25, 2017 · US 9,716,057Granted
- Planar Triple-implanted JfetMay 16, 2017 · US 9,653,618Granted
- Wide Bandgap Junction Barrier Schottky Diode With Silicon BypassMay 4, 2017 · Application 15333622Pending
- Vertical Jfet Made Using A Reduced Mask SetJan 19, 2017 · Application 14798631Pending
- Trench Vertical Jfet With Improved Threshold Voltage ControlNov 17, 2016 · Application 15221641Pending
- Trench Vertical Jfet With Improved Threshold Voltage ControlSep 15, 2016 · Application 14642936Pending
- Hybrid Wide-bandgap Semiconductor Bipolar SwitchesMay 3, 2016 · US 9,331,068Granted
- Silicon Carbide Mosfet With Integrated Mos DiodeApr 26, 2016 · US 9,324,807Granted
- High Voltage SwitchApr 26, 2016 · US 9,325,306Granted
- High Voltage SwitchApr 12, 2016 · US 9,312,847Granted
- High Voltage SwitchNov 17, 2015 · US 9,190,993Granted
- Trench Shield Connected JfetJul 21, 2015 · US 9,087,911Granted
- Cascode Switching CircuitJul 14, 2015 · US 9,083,343Granted
- Vjfet DevicesOct 14, 2014 · US 8,860,098Granted
- Offset Leadframe Cascode PackageApplication PCTUS2017035377Pending
- High Voltage SwitchApplication PCTUS2015054887Pending
- Planar Triple-implanted JfetApplication PCTUS2016057572Pending
- Trench Vertical Jfet With Improved Threshold Voltage ControlApplication PCTUS2017050384Pending
- Self-aligned Shielded-gate Trench Mos-controlled Silicon Carbide Switch With Reduced Miller Capacitance And Method Of Manufacturing The SameApplication PCTUS2015038732Pending
Recent research by its founders
- Extreme Environment Integrated Circuits Based on Enhancement Mode SiC JFETs20200 cites
- High-Performance SIP Half-Bridge IPM Based on 35mΩ/1200V SiC Stack-Cascode20200 cites
- Ultra-high speed 7mohm, 650V SiC half-bridge module with robust short circuit capability for EV inverters20199 cites
Related companies, and why
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- Out of the Fog Research LLCSimilar federal contract value in Semiconductors · $33.3M in contracts
- QUINSTAR TECHNOLOGY, INCORPORATEDSimilar federal contract value in Semiconductors · $30M in contracts
- GLOBAL CIRCUIT INNOVATIONS INCSimilar federal contract value in Semiconductors · $27.7M in contracts
- FORWARD PHOTONICS LLCSimilar federal contract value in Semiconductors · $24.6M in contracts
Sources
Federal grants from SBIR/STTR, NIH, NSF and DoD records. Federal contracts from USAspending.gov. Private capital from SEC Form D. Patents from USPTO. Publications from OpenAlex. Regulatory activity from the Federal Register. Press matched on company name.
How to read this page
Figures show associations in public records, not causes or predictions. Nothing here is investment advice. An em-dash means no record was found under this company's name, not that none exists.
Data freshness
SEC Form D filings through . SBIR and STTR awards through .