GLOBAL CIRCUIT INNOVATIONS INC
Reverse-engineered replacement microcircuits and circuit card assemblies for obsolete defense and industrial electronics
- Sector
- Semiconductors
- Headquarters
- Colorado Springs, CO
- Total capital
- $30.8M
- Federal grants
- $3.1M
- 8 awards · 2017–2024
- Rank in peer group#47 of 72
- Private capital raised
- None on recordNo Form D filings on SEC EDGAR. Some raises are not filed.
- Federal contracts
- $27.7M
- 57 awards · Defense
- Rank in Semiconductors#12 of 707
- Granted patents
- 5
- 1 pending · first 2021
- Rank in peer group#19 of 72
Capital timeline
Latest events
- Federal contractDefense · 8512088828!ELECTRONIC Componen$98K
- Federal contractDefense · 8511918307!CIRCUIT Card Assemb$216K
- Federal contractDefense · 8511797909!RESISTOR,VARIABLE,W$108K
- Federal contractDefense · 8511717521!ELECTRONIC Componen$58K
- Federal contractDefense · Small Business Innovative Research SBIR III Global Circuit Innovation - Proposal Ph III-0025 For Reverse Engineering A Transformer For The USAF Nsn: 5950- 01-669-0589$97K
- Federal contractDefense · 8511498642!MICROCIRCUIT,DIGITA$2K
- Federal contractDefense · 8511449646!ELECTRONIC Componen$82K
Show 57 earlier federal awards
- Federal contractDefense · 8511336694!CIRCUIT Card Assemb$40K
- Federal contractDefense · 8511145336!ELECTRONIC Componen$56K
- Federal contractDefense · 8511109871!CIRCUIT Card Assemb$161K
- Federal contractDefense · 8510921339!CIRCUIT Card Assemb$794K
- Federal contractDefense · 8510876721!MICROCIRCUIT,DIGITA$2K
- Federal grantDefense · Phase I · Small Business Innovative Research (SBIR) Phase I Proposal #L241-P01-0049 Tendered Under Topic #DLA241-P01 Advertised In SBIR Broad Agency Announcement (baa) #SBIR 24.1 For New Source Of Supply For Legacy Components With DOD Requirements$217K
- Federal contractDefense · Small Business Innovative Research (SBIR) Phase I Proposal #L241-P01-0049 Tendered Under Topic #DLA241-P01 Advertised In SBIR Broad Agency Announcement (baa) #SBIR 24.1 For New Source Of Supply For Legacy Components With DOD Requirements$217K
- Federal grantDefense · Phase II · Small Business Technology Transfer (STTR) Phase II Award For Spare Parts Of Nsn 5998-00-338-7373 And Nsn 5998-01-348-7781$781K
- Federal contractDefense · Small Business Technology Transfer (STTR) Phase II Award For Spare Parts Of Nsn 5998-00-338-7373 And Nsn 5998-01-348-7781$781K
- Federal contractDefense · 8510245357!COIL,ELECTRICAL$6K
- Federal contractDefense · 8510224714!CIRCUIT Card Assemb$64K
- Federal contractDefense · 8510175732!TRANSFORMER,POWER$149K
- Federal contractDefense · 8510122073!ELECTRONIC Componen$76K
- Federal grantDefense · Phase I · NSN 5998-00-338-7373 and NSN 5998-01-374-2558 Reverse Engineering$74K
- Federal contractDefense · 8509995582!TRANSFORMER,POWER$2.1M
- Federal contractDefense · 8509985452!TRANSFORMER,POWER$172K
- Federal contractDefense · 8509883900!CIRCUIT Card Assemb$239K
- Federal contractDefense · Research And Development SBIR Ph II$1.8M
- Federal contractDefense · Reverse Engineering Of Sole Source Components$73K
- Federal contractDefense · 8509867583!TRANSFORMER,POWER$156K
- Federal contractDefense · 8509706706!ELECTRONIC Componen$144K
- Federal contractDefense · 8509552843!CIRCUIT Card Assemb$430K
- Federal contractDefense · 8509426456!TRANSFORMER,POWER$823K
- Federal contractDefense · 8509423240!ELECTRONIC Componen$147K
- Federal contractDefense · 8509294668!24000BTUH Environmental Circu$316K
- Federal contractDefense · Engineering Of Obsolete Hybrid Digital RF Interface Multichip Module$749K
- Federal grantDefense · Phase II · Reverse Engineering of Obsolete A2A1 CCA for Columbia Class Submarine$987K
- Federal contractDefense · SBIR Phase II R&d$2.5M
- Federal contractDefense · 8508862277!MICROCIRCUIT,DIGITA$2K
- Federal contractDefense · 8508782080!ELECTRONIC Componen$443K
- Federal contractDefense · SBIR II Integrated Circuit Die Extraction And Reassembly$749K
- Federal contractDefense · 8508799343!ELECTRONIC Componen$515K
- Federal contractDefense · Sbir/sttr Phase I Research & Development - Error Detection And Latch-up Prevention In Radiation Hardened Logic Units$146K
- Federal contractDefense · EO14042 Defense R&dexperimental Devel$1.2M
- Federal contractDefense · Engineering Of Obsolete Hybrid Digital Radio Frequency Interface Multichip Module$49K
- Federal contractDefense · EO14042 Defense R&d Experimental Devel$810K
- Federal contractDefense · Create A New Source Of Supply For Electronic Components.$47K
- Federal contractDefense · 8508368285!MICROCIRCUIT,HYBRID$85K
- Federal contractDefense · 8507474175!SERVICES - Basic Research$1.8M
- Federal contractDefense · 8507470195!SERVICES - Basic Research$994K
- Federal contractDefense · COVID-19 Dib And Reverse Engineering Of Obsolete 512K X 32 Bit Static Random Access Memory (sram)$736K
- Federal contractDefense · STTR Phase II: The Purpose Of This Effort Is For Power Electronics Thermal Interfaces (peti) For A High Temperature And Superior Heat Transfer Die-attach Material To Accommodate Stresses Between High-power Semiconductors And The Substrates.$100K
- Federal grantDefense · Phase I · Reverse Engineering of 512Kx32 Static Random Access Memory (SRAM)$50K
- Federal contractDefense · Igf Ot Igf Services Basic Research Po 8506958484$200K
- Federal contractDefense · Igf Ot Igf Services Basic Research Po 8506958954$200K
- Federal contractDefense · 8506941474!SERVICES - SBIR Phase 1 Award For R&d.$100K
- Federal contractDefense · Igf Ot Igf Services Basic Research Po 8506941057$300K
- Federal contractDefense · Ic Die Extraction&reassembly Automation SBIR I$150K
- Federal contractDefense · Power Electronics Thermal Interface (peti) With Conductive Diamond Plating$25K
- Federal grantDefense · Phase I · Reverse Engineering of Obsolete “Digital Timing Generatorâ€� Microcircuit to Provide Drop-in Replacement for F-16 Radar Application$75K
- Federal contractDefense · Rif FY17 Obsolete Programmable Integrated Circuits "igf::ot::igf"$3M
- Federal grantDefense · Phase I · Building Die Extracted/Repackaged (DER)-Optical Hybrid Integrated Circuits (ICs) to Replace Passive Devices and Obsolete Packaged ICs in a Line Replaceable Unit (LRU) to Enhance Performance, Reliabili$150K
- Federal grantDefense · Phase II · Integrated Circuit (IC) Die Extraction and Reassembly$750K
- Federal contractDefense · Igf::ot::igf Die Extraction Reassembly$2.8M
- Federal contractDefense · Igf::ot::igf Increased High-temperature Reliability For Die Extraction And Reassembly$150K
- Federal contractDefense · Igf::ot::igf Long Term Reliability Testing And Evaluation For Ic Due Extraction And Re-assembly$150K
- Federal contractDefense · Igf::ot::igf Die Extraction Reassembly Process$346K
Federal awards are summed by year (64 awards); hover a bar for the split. Form D reports securities sold, which can differ from an announced round; filings are numbered in the order they were made.
1 record has no date or no amount, so it isn’t placed on the timeline.
Standing among 72 peers
Line = medianSemiconductors · Device
- Federal grantsBelow median
- Granted patents#19 · top 26%
Cumulative measures favor older companies. Rankings describe position today, not outcome. Below the median, ranks show as a band rather than a number.
Founders and team
No founders are linked to this company yet.
Founders appear once a person is matched to the company through its own patents, grants or filings. We never infer people from social profiles.
Checked: USPTO inventors; federal award principal investigators; SEC Form D related persons · Oct 23, 2026
Claim this profile to add your teamWhat it has protected
USPTO · 5 granted of 6- GrantedSolder Ball Application for Singular DieUSPTOUS 11,978,711
- GrantedChemical evaporation Control SystemUSPTOUS 11,618,951
- GrantedSolder Ball Application for Singular DieUSPTOUS 11,508,680
Show all 6 patent records
- Solder Ball Application for Singular DieMay 7, 2024 · US 11,978,711Granted
- Chemical evaporation Control SystemApr 4, 2023 · US 11,618,951Granted
- Solder Ball Application for Singular DieNov 22, 2022 · US 11,508,680Granted
- Low Profile Integrated CircuitFeb 22, 2022 · US 11,257,726Granted
- Conductive Diamond Application SystemAug 3, 2021 · US 11,077,654Granted
- Low Profile Electronic System Method and ApparatusApr 25, 2019 · Application 15792472Pending
Related companies, and why
- Out of the Fog Research LLCSimilar federal contract value in Semiconductors · $33.3M in contracts
- United Silicon Carbide, Inc.Similar federal contract value in Semiconductors · $31M in contracts
- QUINSTAR TECHNOLOGY, INCORPORATEDSimilar federal contract value in Semiconductors · $30M in contracts
- FORWARD PHOTONICS LLCSimilar federal contract value in Semiconductors · $24.6M in contracts
- CYCUITY, INC.Similar federal contract value in Semiconductors · $23.2M in contracts
- Princeton OptronicsSimilar federal contract value in Semiconductors · $23.1M in contracts
Sources
Federal grants from SBIR/STTR, NIH, NSF and DoD records. Federal contracts from USAspending.gov. Private capital from SEC Form D. Patents from USPTO. Publications from OpenAlex. Regulatory activity from the Federal Register. Press matched on company name.
How to read this page
Figures show associations in public records, not causes or predictions. Nothing here is investment advice. An em-dash means no record was found under this company's name, not that none exists.
Data freshness
SEC Form D filings through . SBIR and STTR awards through .