Terecircuits Corporation

MOUNTAIN VIEW, CA · Semiconductors · Private

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Updated Oct 23, 2026 · terecircuits.com

Sector: Semiconductors
Headquarters: MOUNTAIN VIEW, CA
Latest Form D: $1.4M, Jul 2022
Total capital: $2.9M

Federal grants: $1.4M; 2 awards · 2020–2022; Rank in peer group#15 of 17
Private capital raised: $1.4M; 1 Form D · last Jul 2022; 52 months since last filing
Federal contracts: None on recordNo federal contract awards found.
Granted patents: 1; 21 pending · first 2026; Rank in peer group#8 of 17

Capital timeline

Latest events

Oct 2022Federal grantNSF · Phase II · SBIR Phase II:Photopolymer-based Microelectronic Device Transfer Process$1.2M
Jul 2022Private capital raisedForm D · SEC · 1st filing$1.4M
Aug 2020Federal grantNSF · Phase I · SBIR Phase I: Photopolymer-based Microelectronic Device Transfer Process$256K

Node area is scaled to amount. Form D reports securities sold, which can differ from an announced round; filings are numbered in the order they were made.

Federal first

23months

from Terecircuits Corporation’s first federal award to its first private round.

First federal award · Aug 2020: NSF · $256K
First Form D · Jul 2022: $1.4M · 1st Form D
Awards before first raise: 1 award

An association in public records, not a cause or a prediction.

Standing among 17 peers

Line = median

Semiconductors · Material

Federal grantsBelow median
Granted patents#8 · top 47%

Cumulative measures favor older companies. Rankings describe position today, not outcome. Below the median, ranks show as a band rather than a number.

Founders and team

From SEC Form D filings

Wayne RickardExecutive Officer, DirectorNamed in SEC Form D filings

What it has protected

USPTO · 1 granted of 22

Apr 7, 2026GrantedPhotochemical And Thermal Release Layer Processes And Uses In Device ManufacturingUSPTOUS 12,596,306
Oct 19, 2023PendingComposite Material Comprising A Release Material And A Thermopolymer Material, And Uses ThereofUSPTOApplication 18300002
Apr 27, 2023PendingRelease Layer Composition For Transfer Of ComponentsUSPTOApplication 17820482

Show all 22 patent records

Photochemical And Thermal Release Layer Processes And Uses In Device ManufacturingApr 7, 2026 · US 12,596,306Granted
Composite Material Comprising A Release Material And A Thermopolymer Material, And Uses ThereofOct 19, 2023 · Application 18300002Pending
Release Layer Composition For Transfer Of ComponentsApr 27, 2023 · Application 17820482Pending
Selective Donor Plates, Methods Of Fabrication And Uses Thereof For Assembling Components Onto SubstratesOct 6, 2022 · Application 17657242Pending
Assemblies Used For Embedding Integrated Circuit Assemblies, And Their Uses And Method Of Fabrication ThereofOct 6, 2022 · Application 17657247Pending
Intermittently Photobleached Masks, Methods Of Fabrication And Uses For Component TransferOct 6, 2022 · Application 17656515Pending
Release Layer Composition For Transfer Of ComponentsApplication PCTUS2022075086Pending
Release Layer Comprising A Degradable Compound And A Wax, And Uses ThereofApplication 63362988Pending
Assemblies Used For Embedding Integrated Circuit Assemblies, And Their Uses And Method Of Fabrication ThereofApplication PCTUS2022022532Pending
Selective Donor Plates, Methods Of Fabrication And Uses Thereof For Assembling Components Onto SubstratesApplication PCTUS2022022514Pending
Intermittently Photobleached Masks, Methods Of Fabrication And Uses For Component TransferApplication PCTUS2022021933Pending
Photochemical And Thermal Release Layer Processes And Uses In Device ManufacturingApplication 63278323Pending
Release Layer Composition For Transfer Of ComponentsApplication 63234406Pending
Materials And Process For Error-correcting Component TransfersApplication 63169701Pending
Method And Apparatus For Assembling Components Onto SubstratesApplication 63169651Pending
Synthesis Of TETRALIN-1,4-DIONE, Compositions And Apparatuses ThereofApplication PCTUS2024058650Pending
Materials For Embedding Integrated Circuit AssembliesApplication 63169658Pending
Synthesis Of TETRALIN-1,4-DIONE, Compositions And Apparatuses ThereofApplication 63607452Pending
Patterned Release Layers, And Methods Of Making And Using Them In Device ManufacturingApplication PCTUS2023031304Pending
Composite Material Comprising A Release Material And A Thermopolymer Material, And Uses ThereofApplication PCTUS2023018529Pending
Photochemical And Thermal Release Layer Processes And Uses In Device ManufacturingApplication PCTUS2022049432Pending
Patterned Release Layers, And Methods Of Making And Using Them In Device ManufacturingApplication 63373900Pending

Blaize Holdings, Inc.Similar federal contract value in Semiconductors · null in contracts
SENSIT VENTURES, INC.Similar federal contract value in Semiconductors · null in contracts
NimbeLink Corp.Similar federal contract value in Semiconductors · null in contracts
NEWPATH RESEARCH LLCSimilar federal contract value in Semiconductors · null in contracts
LUMINA INSTRUMENTS INC.Similar federal contract value in Semiconductors · null in contracts
MuMEC, Inc.Similar federal contract value in Semiconductors · null in contracts

Sources

Federal grants from SBIR/STTR, NIH, NSF and DoD records. Federal contracts from USAspending.gov. Private capital from SEC Form D. Patents from USPTO. Publications from OpenAlex. Regulatory activity from the Federal Register. Press matched on company name.

How to read this page

Figures show associations in public records, not causes or predictions. Nothing here is investment advice. An em-dash means no record was found under this company's name, not that none exists.

Data freshness

SEC Form D filings through Oct 23, 2026. SBIR and STTR awards through Oct 21, 2026.