PSEUDOLITHIC INC.
Heterogeneous integrated circuits combining compound semiconductor transistors (InP, GaAs, GaN) on silicon interposers for mm-Wave and terahertz analog circuits
- Sector
- Semiconductors
- Headquarters
- Santa Barbara, CA
- Total capital
- $9.8M
- Federal grants
- $6.4M
- 8 awards · 2021–2023
- Rank in peer group#24 of 72
- Private capital raised
- None on recordNo Form D filings on SEC EDGAR. Some raises are not filed.
- Federal contracts
- $3.5M
- 2 awards · Defense
- Rank in Semiconductors#72 of 707
- Granted patents
- 10
- 12 pending · first 2023
- Rank in peer group#12 of 72
Capital timeline
Latest events
- Federal grantEnergy · Phase II · THz Heterogeneous Integration for Next generation Communications (THINC) Phase 2$1.1M
- Federal grantNSF · Phase II · SBIR Phase II:Integration of Heterogeneous Device Technologies$1.5M
- Federal contractDefense · W-band Receiver With Anti-jam Protection (wrap)$3.2M
- Federal grantDefense · Phase I · Counter-UAS Novel Testbed and Enhanced Radar (CoUNTER)$173K
- Federal grantDefense · Phase II · Rapid Manufacturing of Heterogeneous mm-Wave Phased Arrays$1.5M
- Federal grantDefense · Phase II · Pseudolithic Integration for mm-wave Transceivers with Chiplet HEMTs$1.5M
- Federal grantEnergy · Phase I · THz Heterogeneous Integration for Next generation Communications (THINC)$200K
Show 3 earlier federal awards
- Federal grantDefense · Phase I · W-band Receiver with Anti-jam Protection (WRAP)$146K
- Federal grantNSF · Phase I · SBIR Phase I: Pseudolithic Integration of Heterogeneous Device Technologies$256K
- Federal contractDefense · Kick-off Briefing Materials & Fwa Cert.$240K
Node area is scaled to amount. Form D reports securities sold, which can differ from an announced round; filings are numbered in the order they were made.
Standing among 72 peers
Line = medianSemiconductors · Device
- Federal grants#24 · top 33%
- Granted patents#12 · top 17%
Cumulative measures favor older companies. Rankings describe position today, not outcome. Below the median, ranks show as a band rather than a number.
Founders and team
No founders are linked to this company yet.
Founders appear once a person is matched to the company through its own patents, grants or filings. We never infer people from social profiles.
Checked: USPTO inventors; federal award principal investigators; SEC Form D related persons · Oct 23, 2026
Claim this profile to add your teamWhat it has protected
USPTO · 10 granted of 22- PendingElectrostatic Protection Of Heterogeneously-integrated SemiconductorsUSPTOApplication 19420221
- GrantedDual-polarization And Dual-band Radio Frequency (RF) Transceivers With Leakage And Image Rejection CalibrationUSPTOUS 12,658,854
- PendingBuilt In Self-test Of Heterogeneous Integrated Radio Frequency ChipletsUSPTOApplication 19165066
Show all 22 patent records
- Electrostatic Protection Of Heterogeneously-integrated SemiconductorsJun 18, 2026 · Application 19420221Pending
- Dual-polarization And Dual-band Radio Frequency (RF) Transceivers With Leakage And Image Rejection CalibrationJun 16, 2026 · US 12,658,854Granted
- Built In Self-test Of Heterogeneous Integrated Radio Frequency ChipletsJan 22, 2026 · Application 19165066Pending
- Heterogeneous Integration Of Radio Frequency Transistor Chiplets Having Interconnections To Wafer Circuits For Optimizing Operating ConditionsDec 25, 2025 · Application 19240985Pending
- Heterogeneous Integration Of Radio Frequency Transistor Chiplets Having Interconnections To Host Wafer Circuits For Optimizing Operating ConditionsDec 25, 2025 · Application 19011294Pending
- Heterogeneous Integration Of Radio Frequency Transistor Chiplets Having Interconnection Tuning CircuitsSep 11, 2025 · Application 19220027Pending
- Chip Integration Into Cavities Of A Wafer Using Lateral Dielectric Material BondingJul 3, 2025 · Application 19069157Pending
- Heterogeneous Integration Of Radio Frequency Transistor Chiplets Having Interconnection Tuning CircuitsJun 3, 2025 · US 12,322,714Granted
- Chip Integration Into Cavities Of A Host Wafer Using Lateral Dielectric Material BondingMar 25, 2025 · US 12,261,091Granted
- Heterogeneous Integration Of Radio Frequency Transistor Chiplets Having Interconnections To Host Wafer Circuits For Optimizing Operating ConditionsJan 7, 2025 · US 12,191,295Granted
- Chip Integration Into Cavities Of A Host Wafer Using Lateral Dielectric Material BondingOct 22, 2024 · US 12,125,759Granted
- Built In Self-test Of Heterogeneous Integrated Radio Frequency ChipletsSep 24, 2024 · US 12,099,092Granted
- Multi-thickness Chip Integration Into Cavities Of A Host Wafer Using Lateral Dielectric MaterialSep 12, 2024 · Application 18666533Pending
- Built In Self-test Of Heterogeneous Integrated Radio Frequency ChipletsMar 26, 2024 · US 11,940,495Granted
- Heterogeneous Integration Of Radio Frequency Transistor Chiplets Having Interconnection Tuning CircuitsNov 7, 2023 · US 11,810,876Granted
- Chip Integration Into Cavities Of A Host Wafer Using Lateral Dielectric Material BondingSep 12, 2023 · US 11,756,848Granted
- Built In Self-test Of Heterogeneous Integrated Radio Frequency ChipletsAug 22, 2023 · US 11,733,297Granted
- Chip Integration Into Cavities Of A Host Wafer Using Lateral Dielectric Material BondingApplication PCTUS2023086098Pending
- Built In Self-test Of Heterogeneous Integrated Radio Frequency ChipletsApplication PCTUS2024014661Pending
- Heterogeneous Integration Of Radio Frequency Transistor Chiplets Having Interconnection Tuning CircuitsApplication PCTUS2024014897Pending
- Electrostatic Protection Of Heterogeneously-integrated SemiconductorsApplication 63734614Pending
- Multi-thickness Chip Integration Into Cavities Of A Host Wafer Using Lateral Dielectric MaterialApplication PCTUS2025025039Pending
Related companies, and why
- PSEUDOLITHIC, LLCShares a founder: James F Buckwalter, Daniel S Green
- CEREBRAS SYSTEMS INCSimilar federal contract value in Semiconductors · $3.7M in contracts
- EOTRON LLCSimilar federal contract value in Semiconductors · $3.6M in contracts
- OSEMI INCSimilar federal contract value in Semiconductors · $3.5M in contracts
- KYMA TECHNOLOGIES, INC.Similar federal contract value in Semiconductors · $3.4M in contracts
- GSI TECHNOLOGY, INC.Similar federal contract value in Semiconductors · $3.4M in contracts
Sources
Federal grants from SBIR/STTR, NIH, NSF and DoD records. Federal contracts from USAspending.gov. Private capital from SEC Form D. Patents from USPTO. Publications from OpenAlex. Regulatory activity from the Federal Register. Press matched on company name.
How to read this page
Figures show associations in public records, not causes or predictions. Nothing here is investment advice. An em-dash means no record was found under this company's name, not that none exists.
Data freshness
SEC Form D filings through . SBIR and STTR awards through .