EPACK, INC.

Semiconductors · Acquired

Environment-resistant inertial measurement unit (eIMU) with thermal control and stress isolation packaging for high-performance navigation

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Updated Oct 23, 2026

Sector: Semiconductors
Total capital: $7.3M

Federal grants: $1.5M; 1 award · 2016; Rank in peer group#29 of 68
Private capital raised: None on recordNo Form D filings on SEC EDGAR. Some raises are not filed.
Federal contracts: $5.8M; 10 awards · Defense, NASA; Rank in Semiconductors#54 of 707
Granted patents: 2; 3 pending · first 2019; Rank in peer group#21 of 68

Capital timeline

Latest events

Sep 2016Federal grantDefense · Phase II · Ovenized Inertial Micro Electro Mechanical Systems$1.5M
Sep 2016Federal contractDefense · Igf::ot::igf Darpa Fy 2015.2 Solicitation - SBIR Ph II Titled "ovenized Intertial Micro Electro Mechanical Systems"$1.7M
Jun 2016Federal contractDefense · Igf::ot::igf This Contract Is A Cost Plus Fixed Fee (cpff)contract, Small Business Innovative Research (SBIR) Program, Phase II Effort Under Topic: A14-031, For Project Title: "high-performance, Low-power, Acceleration-compensated Oscillator Technology."$1.0M
Sep 2015Federal contractDefense · Igf::ot::igf SBIR Phase I Entitled, "ovenized Inertial Micro Electro Mechanical Systems$150K
Aug 2014Federal contractDefense · SBIR Phase 1$150K
Sep 2013Federal contractDefense · Novel Temperature And Vibration Tolerant Packaging For Intertial Sensors (mems)$1.3M
Dec 2012Federal contractDefense · Research And Development SBIR Phase II Topic N112-126$1.0M

Show 4 earlier federal awards

Jun 2012Federal contractDefense · Research And Development In The Physical, Engineering, And Life Sciences (except Biotechnology)$150K
Sep 2011Federal contractDefense · Research And Development SBIR Phase I Topic N112-126$150K
Feb 2011Federal contractNASA · The Objective Of This Proposal Is To Demonstrate The Feasibility Of A Fully Packaged Microelectromechanical (mems) Gyroscope With A 7 Milliarcsecond Pointing Accuracy Sufficient For Space And Terrestrial Telescope Pointing Applications. This New Environmental Resistant Packaged (erp) Resonant Gyroscope Will Have A Small Size, Weight And Power (swap) With A Mass Of Around 6 Grams And A Volume Of 3.1 CM3 (fully Packaged And With Drive Electronics) At A Cost Of $500 Per Axis In Volume Production. T$100K
Feb 2010Federal contractDefense · SBIR I$100K

Node area is scaled to amount. Form D reports securities sold, which can differ from an announced round; filings are numbered in the order they were made.

Standing among 68 peers

Line = median

Semiconductors · Device

Federal grants#29 · top 43%
Granted patents#21 · top 31%
Linked publications#1 · top 1%

Cumulative measures favor older companies. Rankings describe position today, not outcome. Below the median, ranks show as a band rather than a number.

Founders and team

No founders are linked to this company yet.

Founders appear once a person is matched to the company through its own patents, grants or filings. We never infer people from social profiles.

Checked: USPTO inventors; federal award principal investigators; SEC Form D related persons · Oct 23, 2026

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What it has protected

USPTO · 2 granted of 5

Apr 7, 2020GrantedMems Isolation Platform With Three-dimensional Vibration And Stress IsolationUSPTOUS 10,611,628
Aug 20, 2019GrantedSystem With Oven Control And Compensation For Detecting Motion And/or OrientationUSPTOUS 10,386,385
Aug 8, 2019PendingSpace-efficient Planar Interposer For Environment-resistant PackagingUSPTOApplication 16268636

Show all 5 patent records

Mems Isolation Platform With Three-dimensional Vibration And Stress IsolationApr 7, 2020 · US 10,611,628Granted
System With Oven Control And Compensation For Detecting Motion And/or OrientationAug 20, 2019 · US 10,386,385Granted
Space-efficient Planar Interposer For Environment-resistant PackagingAug 8, 2019 · Application 16268636Pending
Vibration Isolator Platform With Electronic Acceleration CompensationApplication 62632591Pending
Space-efficient Planar Interposer For Environment-resistant PackagingApplication 62626767Pending

Recent research by its founders

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FABMETRIX INCSimilar federal contract value in Semiconductors · $5.8M in contracts
BANPIL PHOTONICS IncSimilar federal contract value in Semiconductors · $5.8M in contracts
LASER THERMAL ANALYSIS, INCSimilar federal contract value in Semiconductors · $5.6M in contracts
Morton Photonics IncorporatedSimilar federal contract value in Semiconductors · $5.6M in contracts

Sources

Federal grants from SBIR/STTR, NIH, NSF and DoD records. Federal contracts from USAspending.gov. Private capital from SEC Form D. Patents from USPTO. Publications from OpenAlex. Regulatory activity from the Federal Register. Press matched on company name.

How to read this page

Figures show associations in public records, not causes or predictions. Nothing here is investment advice. An em-dash means no record was found under this company's name, not that none exists.

Data freshness

SEC Form D filings through Oct 23, 2026. SBIR and STTR awards through Oct 21, 2026.