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Bridge Semiconductor Corp

PITTSBURGH, PA · Founded 2010 · Semiconductors · Private

Semiconductor substrates and lead frames for microelectronic packaging

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Updated · bridgesemiconductor.com

Sector
Semiconductors
Headquarters
PITTSBURGH, PA
Founded
2010
Latest Form D
$1.4M, May 2012
Total capital
$13.3M
Federal grants
None on recordNo awards found in SBIR/STTR, NIH, NSF or DoD records.
Private capital raised
$13.3M
5 Form D · last May 2012
174 months since last filing
Federal contracts
None on recordNo federal contract awards found.
Granted patents
9
26 pending · first 2019
Rank in peer group#5 of 20

Capital timeline

201020112012FEDERAL ↑EQUITY ↓Cumulative $13.3M1st Form D$7M2nd Form D$2.6M5th Form D$1.4M
201020112012FEDERAL ↑EQUITY ↓Cumulative $13.3M1st Form D$7M

Latest events

  • Private capital raisedForm D · SEC · 5th filing$1.4M
  • Private capital raisedForm D · SEC · 4th filing$577K
  • Private capital raisedForm D · SEC · 3rd filing$1.6M
  • Private capital raisedForm D · SEC · 2nd filing$2.6M
  • Private capital raisedForm D · SEC · 1st filing$7M

Node area is scaled to amount. Form D reports securities sold, which can differ from an announced round; filings are numbered in the order they were made.

Standing among 20 peers

Line = median

Semiconductors · Material

  • Granted patents#5 · top 25%

Cumulative measures favor older companies. Rankings describe position today, not outcome. Below the median, ranks show as a band rather than a number.

Founders and team

From SEC Form D filings
  • Carl A. CohenDirectorNamed in SEC Form D filings
  • Donald A. MattesDirectorNamed in SEC Form D filings
  • Edward D. NapoleoneDirectorNamed in SEC Form D filings
  • H. Donald PerkinsDirectorNamed in SEC Form D filings
  • John D. TedeschiExecutive OfficerNamed in SEC Form D filings
  • Joseph D. AcquavivaExecutive OfficerNamed in SEC Form D filings
Show all 13 people
  • Joshua ZiffDirector, Executive OfficerNamed in SEC Form D filings
  • Kenneth A. SkolnickDirectorNamed in SEC Form D filings
  • Ken SkolnickDirectorNamed in SEC Form D filings
  • Lawrence J. WeidmanExecutive Officer, DirectorNamed in SEC Form D filings
  • Robert C. FunderlichExecutive OfficerNamed in SEC Form D filings
  • Thomas H. WitmerDirectorNamed in SEC Form D filings
  • William Donald BridgersDirectorNamed in SEC Form D filings

What it has protected

USPTO · 9 granted of 35
Show all 35 patent records
  • Semiconductor Assembly Having A Warpage Inhibitor In Combination With A SealantAug 27, 2026 · Application 19548216Pending
  • Interconnect Board Having Dielectric Frame And Embedded Electrically Connectable Entity And Semiconductor Assembly Using The SameJul 23, 2026 · Application 19451415Pending
  • Multi-level Staggered Terminal Structure And Semiconductor Package And Assembly Using The SameMay 19, 2026 · US 12,635,535Granted
  • Terminal Structure With Depression Region Below Dielectric Wall And Semiconductor Package Having The SameMay 14, 2026 · Application 18947792Pending
  • Semiconductor Assembly Having Dual Conduction Channels For Electricity And Heat PassageMar 10, 2026 · US 12,575,434Granted
  • Interconnect Board With Electronic Component Embedded In Thermally Enhanced Cavity SubstrateJan 8, 2026 · Application 19213052Pending
  • Semiconductor Packaging Substrate With Interconnect Units Bounded By Dielectric FrameMar 6, 2025 · Application 18823490Pending
  • Lead Frame Substrate Having Circuitry On Dual Dielectric Layers And Assembly Using The SameOct 31, 2024 · Application 18646482Pending
  • Leadframe Substrate Having Modulator And Crack Inhibiting Structure And Flip Chip Assembly Using The SameMar 29, 2022 · US 11,291,146Granted
  • Interconnect Substrate Having Buffer Material And Crack Stopper And Semiconductor Assembly Using The SameSep 16, 2021 · Application 17334033Pending
  • Interconnect Substrate With Stiffener And Warp Balancer And Semiconductor Assembly Using The SameOct 13, 2020 · US 10,804,205Granted
  • Thermally Enhanced Assembly With Metallic Interfacial Structure Between Heat Generating Component And Heat SpreaderSep 24, 2020 · Application 16823895Pending
  • Semiconductor Assembly Having Dual Wiring Structures And Warp BalancerMay 7, 2020 · Application 16727661Pending
  • Interconnect Substrate With Etching Stoppers Within Cavity And Metal Leads Around Cavity And Semiconductor Assembly Using The SameApr 30, 2020 · Application 16730814Pending
  • 3-D Stacking Semiconductor Assembly Having Heat Dissipation CharacteristicsMar 19, 2020 · Application 16691193Pending
  • Methods Of Making Wiring Substrate For Stackable Semiconductor Assembly And Making Stackable Semiconductor AssemblyJan 28, 2020 · US 10,546,808Granted
  • Face-to-face Semiconductor Assembly Having Semiconductor Device In Dielectric RecessOct 15, 2019 · US 10,446,526Granted
  • Heat Conductive Wiring Board And Semiconductor Assembly Using The SameAug 29, 2019 · Application 16411949Pending
  • Wiring Board Having Component Integrated With Leadframe And Method Of Making The SameApr 23, 2019 · US 10,269,722Granted
  • Wiring Substrate For Stackable Semiconductor Assembly And Stackable Semiconductor Assembly Using The SameMar 26, 2019 · US 10,242,964Granted
  • Interconnect Substrate Having Stress Modulator And Flip Chip Assembly ThereofMar 21, 2019 · Application 16194023Pending
  • Methods Of Making Wiring Substrate For Stackable Semiconductor Assembly And Making Stackable Semiconductor AssemblyFeb 19, 2019 · US 10,211,067Granted
  • Methods Of Making Interconnect Substrate Having Stress Modulator And Crack Inhibiting Layer And Making Flip Chip Assembly ThereofDec 13, 2018 · Application 16046243Pending
  • Method Of Making Wiring Board With Dual Routing Circuitries Integrated With LeadframeSep 13, 2018 · Application 15976106Pending
  • Method Of Making Thermally Enhanced Wiring Board Having Isolator Incorporated ThereinSep 13, 2018 · Application 15976307Pending
  • Method Of Making Wiring Board With Interposer And Electronic Component Incorporated With Base BoardJun 14, 2018 · Application 15881119Pending
  • Interconnect Board Having Dielectric Frame and Embedded Electronic Component and Semiconductor Assembly Using the SameApplication 63746962Pending
  • Semiconductor Package Having Multi-level Staggered TerminalApplication 63407449Pending
  • Lead Frame Substrate Having Routing Circuitry on Dual Dielectric LayersApplication 63462717Pending
  • Semiconductor Packaging Substrate Having Dual Dielectric Layers For Stress Modulation And Crack PreventionsApplication 63580771Pending
  • Heat Conductive Wiring Board And Semiconductor Assembly Using The SameApplication 16400879Pending
  • Heat-Conductive Interfacial Structure by Integrally Formed Metal LayerApplication 62821059Pending
  • Thermally Enhanced Cavity Substrate And Embedded Component AssemblyApplication 63668609Pending
  • Semiconductor Assembly Having Dual Heat Conduction ChannelsApplication 63398957Pending
  • Semiconductor Assembly Having Warpage Inhibitor Embedded in Stress-Relief SealantApplication 63763505Pending

Related companies, and why

  • QUANTASPEC, INC.Similar federal contract value in Semiconductors · null in contracts
  • Inertial Sense, Inc.Similar federal contract value in Semiconductors · null in contracts
  • Ranovus Inc.Similar federal contract value in Semiconductors · null in contracts
  • NextInput, Inc.Similar federal contract value in Semiconductors · null in contracts
  • Wise Owl Holdings LLCSimilar federal contract value in Semiconductors · null in contracts
  • Mill Computing, Inc.Similar federal contract value in Semiconductors · null in contracts

Sources

Federal grants from SBIR/STTR, NIH, NSF and DoD records. Federal contracts from USAspending.gov. Private capital from SEC Form D. Patents from USPTO. Publications from OpenAlex. Regulatory activity from the Federal Register. Press matched on company name.

How to read this page

Figures show associations in public records, not causes or predictions. Nothing here is investment advice. An em-dash means no record was found under this company's name, not that none exists.

Data freshness

SEC Form D filings through . SBIR and STTR awards through .