SMART Pad LLC
Engineered polishing pads with controlled micropore structures for Chemical Mechanical Planarization (CMP) in semiconductor manufacturing
- Sector
- Semiconductors
- Headquarters
- REXFORD, NY
- Total capital
- $1.2M
- Federal grants
- $1.2M
- 2 awards · 2019–2020
- Rank in peer group#13 of 15
- Private capital raised
- None on recordNo Form D filings on SEC EDGAR. Some raises are not filed.
- Federal contracts
- None on recordNo federal contract awards found.
- Granted patents
- 0
- 6 pending
Capital timeline
Latest events
- Federal grantNSF · Phase II · SBIR Phase II: Chemical Mechanical Planarization pad with controlled micro features for sub 7nm semiconductor technology$978K
- Federal grantNSF · Phase I · SBIR Phase I: Chemical Mechanical Planarization pad with controlled micro features for sub 7nm semiconductor technology$225K
Node area is scaled to amount. Form D reports securities sold, which can differ from an announced round; filings are numbered in the order they were made.
Standing among 15 peers
Line = medianSemiconductors · Material
- Federal grantsBelow median
Cumulative measures favor older companies. Rankings describe position today, not outcome. Below the median, ranks show as a band rather than a number.
Founders and team
No founders are linked to this company yet.
Founders appear once a person is matched to the company through its own patents, grants or filings. We never infer people from social profiles.
Checked: USPTO inventors; federal award principal investigators; SEC Form D related persons · Oct 23, 2026
Claim this profile to add your teamWhat it has protected
USPTO · 0 granted of 6- PendingPolishing Pad With Protruded Polishing Structures, System For Manufacturing The Same, And Method For Manufacturing The SameUSPTOApplication 17733951
- PendingChemical-mechanical Polishing Pad With Protruded StructuresUSPTOApplication 17070454
- PendingPolishing Pad With Protruded Polishing Structures, System For Manufacturing The Same, And Method For Manufacturing The SameUSPTOApplication PCTUS2022027144
Show all 6 patent records
- Polishing Pad With Protruded Polishing Structures, System For Manufacturing The Same, And Method For Manufacturing The SameDec 29, 2022 · Application 17733951Pending
- Chemical-mechanical Polishing Pad With Protruded StructuresOct 21, 2021 · Application 17070454Pending
- Polishing Pad With Protruded Polishing Structures, System For Manufacturing The Same, And Method For Manufacturing The SameApplication PCTUS2022027144Pending
- Polishing Pad With Protruded Polishing Structures, System For Manufacturing The Same, And Method For Manufacturing The SameApplication 63213925Pending
- Chemical-mechanical Polishing Pad With Protruded StructuresApplication PCTUS2020055496Pending
- Chemical-mechanical Polishing Pad With Protruded StructuresApplication 63013064Pending
Related companies, and why
- QUANTALUX LLCSimilar federal contract value in Semiconductors · null in contracts
- Boston Microtechnology LLCSimilar federal contract value in Semiconductors · null in contracts
- XAVIER OPTICS, INC.Similar federal contract value in Semiconductors · null in contracts
- Sinovia TechnologiesSimilar federal contract value in Semiconductors · null in contracts
- Concurrent Wireless Inc.Similar federal contract value in Semiconductors · null in contracts
- NOVATECH INNOVATIONS LLCSimilar federal contract value in Semiconductors · null in contracts
Sources
Federal grants from SBIR/STTR, NIH, NSF and DoD records. Federal contracts from USAspending.gov. Private capital from SEC Form D. Patents from USPTO. Publications from OpenAlex. Regulatory activity from the Federal Register. Press matched on company name.
How to read this page
Figures show associations in public records, not causes or predictions. Nothing here is investment advice. An em-dash means no record was found under this company's name, not that none exists.
Data freshness
SEC Form D filings through . SBIR and STTR awards through .