SCDEVICE LLC
Radiation-hardened silicon carbide high-voltage semiconductor devices for space applications
- Sector
- Semiconductors
- Headquarters
- Portland, OR
- Total capital
- $1.0M
- Federal grants
- $150K
- 2 awards · 2022–2023
- Rank in peer group#1 of 20
- Private capital raised
- None on recordNo Form D filings on SEC EDGAR. Some raises are not filed.
- Federal contracts
- $850K
- 1 award · NASA
- Rank in Semiconductors#127 of 707
- Granted patents
- 3
- 6 pending · first 2023
- Rank in peer group#7 of 20
Capital timeline
Latest events
- Federal contractNASA · SBIR Phase II Sic Mosfet With Radiation-resistant Gate Oxide Performance To 600V$850K
- Federal grantNASA · Phase I · SiC MOSFET WITH RADIATION-RESISTANT GATE OXIDE PERFORMANCE TO 600V$150K
Node area is scaled to amount. Form D reports securities sold, which can differ from an announced round; filings are numbered in the order they were made.
1 record has no date or no amount, so it isn’t placed on the timeline.
Standing among 20 peers
Line = medianSemiconductors · Material
- Federal grants#1 · top 5%
- Granted patents#7 · top 35%
Cumulative measures favor older companies. Rankings describe position today, not outcome. Below the median, ranks show as a band rather than a number.
Founders and team
No founders are linked to this company yet.
Founders appear once a person is matched to the company through its own patents, grants or filings. We never infer people from social profiles.
Checked: USPTO inventors; federal award principal investigators; SEC Form D related persons · Oct 23, 2026
Claim this profile to add your teamWhat it has protected
USPTO · 3 granted of 9- GrantedVertical Trench Device Configurations for Radiation-Environment ApplicationsUSPTOUS 12,469,705
- GrantedVertical Diode Configurations for Radiation-Environment ApplicationsUSPTOUS 12,464,742
- PendingVertical Semiconductor Devices with Deep Well Region for Radiation HardeningUSPTOApplication 18813547
Show all 9 patent records
- Vertical Trench Device Configurations for Radiation-Environment ApplicationsNov 11, 2025 · US 12,469,705Granted
- Vertical Diode Configurations for Radiation-Environment ApplicationsNov 4, 2025 · US 12,464,742Granted
- Vertical Semiconductor Devices with Deep Well Region for Radiation HardeningFeb 27, 2025 · Application 18813547Pending
- Self Aligned Mosfet Devices And Associated Fabrication MethodsNov 21, 2023 · US 11,823,905Granted
- Vertical Semiconductor Devices With Deep Well Region For Radiation HardeningApplication PCTUS2024043584Pending
- Vertical Diode Configurations for Radiation-Environment ApplicationsApplication 63293372Pending
- Vertical Semiconductor Devices with Deep Well Region for Radiation HardeningApplication 63534116Pending
- Self Aligned Mosfet Devices And Associated Fabrication MethodsApplication PCTUS2023012559Pending
- Vertical Trench Device Configurations for Radiation-Environment ApplicationsApplication 63336575Pending
Related companies, and why
- QUANTTERA LLCSimilar federal contract value in Semiconductors · $1.0M in contracts
- GREEN MOUNTAIN SEMICONDUCTOR, INC.Similar federal contract value in Semiconductors · $985K in contracts
- Cosmic Microwave Technology, Inc.Similar federal contract value in Semiconductors · $937K in contracts
- LyteChip Inc.Similar federal contract value in Semiconductors · $823K in contracts
- REAL INTENTSimilar federal contract value in Semiconductors · $722K in contracts
- TRUSTED SEMICONDUCTOR SOLUTIONS INCSimilar federal contract value in Semiconductors · $689K in contracts
Sources
Federal grants from SBIR/STTR, NIH, NSF and DoD records. Federal contracts from USAspending.gov. Private capital from SEC Form D. Patents from USPTO. Publications from OpenAlex. Regulatory activity from the Federal Register. Press matched on company name.
How to read this page
Figures show associations in public records, not causes or predictions. Nothing here is investment advice. An em-dash means no record was found under this company's name, not that none exists.
Data freshness
SEC Form D filings through . SBIR and STTR awards through .