Safi-tech, Inc.
Supercooled liquid metal microcapsules for low-temperature flip chip solder bump bonding in semiconductor assembly
- Sector
- Semiconductors
- Headquarters
- Ames, IA
- Total capital
- $625K
- Federal grants
- $625K
- 3 awards · 2016–2022
- Rank in peer group#4 of 10
- Private capital raised
- None on recordNo Form D filings on SEC EDGAR. Some raises are not filed.
- Federal contracts
- None on recordNo federal contract awards found.
- Granted patents
- 3
- 7 pending · first 2021
- Rank in peer group#1 of 10
Capital timeline
Latest events
- Federal grantEnergy · Phase I · Replacing Bump Bonding with Self-Assembly of Supercooled Liquid Metal Microcapsules$200K
- Federal grantEnergy · Phase I · No-Heat Soldering using Supercooled Liquid Metal Microcapsules$200K
- Federal grantNSF · Phase I · SBIR Phase I: Stable Undercooled Metal Materials for Soldering Heat-Sensitive Components and Substrates$225K
Node area is scaled to amount. Form D reports securities sold, which can differ from an announced round; filings are numbered in the order they were made.
Standing among 10 peers
Line = medianSemiconductors · Material
- Federal grants#4 · top 40%
- Granted patents#1 · top 10%
Cumulative measures favor older companies. Rankings describe position today, not outcome. Below the median, ranks show as a band rather than a number.
Founders and team
No founders are linked to this company yet.
Founders appear once a person is matched to the company through its own patents, grants or filings. We never infer people from social profiles.
Checked: USPTO inventors; federal award principal investigators; SEC Form D related persons · Oct 23, 2026
Claim this profile to add your teamWhat it has protected
USPTO · 3 granted of 10- GrantedSystem And Method For Manufacture Of Undercooled Metallic Core-shell ParticlesUSPTOUS 11,673,190
- GrantedSolder Paste On Demand ApparatusUSPTOUS 11,633,702
- GrantedDirect Printing And Writing Using Undercooled Metallic Core-shell ParticlesUSPTOUS 11,059,098
Show all 10 patent records
- System And Method For Manufacture Of Undercooled Metallic Core-shell ParticlesJun 13, 2023 · US 11,673,190Granted
- Solder Paste On Demand ApparatusApr 25, 2023 · US 11,633,702Granted
- Direct Printing And Writing Using Undercooled Metallic Core-shell ParticlesJul 13, 2021 · US 11,059,098Granted
- Solder Paste On Demand ApparatusApplication PCTUS2022035915Pending
- System And Method For Manufacture Of Undercooled Metallic Coreshell ParticlesApplication PCTUS2021065451Pending
- Methods And Apparatuses For Supercooled Micro-capsulesApplication 63371994Pending
- Solder Materials Including Supercooled Micro-capsules And Alloyed ParticlesApplication 63265344Pending
- Undercooled Liquid Metallic Droplets Having A Protective ShellApplication PCTUS2021043042Pending
- Solder Paste On Demand ApparatusApplication 63219152Pending
- Solder Materials Including Supercooled Micro-capsules And Alloyed ParticlesApplication 63373379Pending
Related companies, and why
- Surface Applied Fluid Interface Technologies LLCShares a founder: Ian Tevis
- MatX Inc.Similar federal contract value in Semiconductors · null in contracts
- VIRTUAL EM INC.Similar federal contract value in Semiconductors · null in contracts
- MIRIOS, INC.Similar federal contract value in Semiconductors · null in contracts
- AmpliTech Group, Inc.Similar federal contract value in Semiconductors · null in contracts
- Lidrotec Inc.Similar federal contract value in Semiconductors · null in contracts
Sources
Federal grants from SBIR/STTR, NIH, NSF and DoD records. Federal contracts from USAspending.gov. Private capital from SEC Form D. Patents from USPTO. Publications from OpenAlex. Regulatory activity from the Federal Register. Press matched on company name.
How to read this page
Figures show associations in public records, not causes or predictions. Nothing here is investment advice. An em-dash means no record was found under this company's name, not that none exists.
Data freshness
SEC Form D filings through . SBIR and STTR awards through .