PulseForge, Inc.
Digital thermal processing system for manufacturing
- Sector
- Materials
- Headquarters
- AUSTIN, TX
- Founded
- 2022
- Latest Form D
- $28M offered, Jul 2025
- Total capital
- $28M
- Federal grants
- None on recordNo awards found in SBIR/STTR, NIH, NSF or DoD records.
- Private capital raised
- $28M
- 1 Form D · last Jul 2025
- 16 months since last filing
- Federal contracts
- None on recordNo federal contract awards found.
- Granted patents
- 1
- 34 pending · first 2026
- Rank in peer group#7 of 50
Capital timeline
Latest events
- Offering registeredForm D · SEC · 1st filing$28M
Node area is scaled to amount. Form D reports securities sold, which can differ from an announced round; filings are numbered in the order they were made.
Standing among 50 peers
Line = medianMaterials · System
- Granted patents#7 · top 14%
Cumulative measures favor older companies. Rankings describe position today, not outcome. Below the median, ranks show as a band rather than a number.
Founders and team
From SEC Form D filings- Jonathan W GibsonExecutive Officer, DirectorNamed in SEC Form D filings
- Todd W LittlerExecutive OfficerNamed in SEC Form D filings
What it has protected
USPTO · 1 granted of 35- PendingRoughened Carrier for Debonding of Bonded StackUSPTOApplication 19566744
- PendingMethods And Apparatus For Thermal Processing Of MaterialsUSPTOApplication 19354436
- PendingMethod And Apparatus For Temporarily Bonding And Debonding Electronics Structures Relative To CarrierUSPTOApplication 19368873
Show all 35 patent records
- Roughened Carrier for Debonding of Bonded StackAug 6, 2026 · Application 19566744Pending
- Methods And Apparatus For Thermal Processing Of MaterialsJun 4, 2026 · Application 19354436Pending
- Method And Apparatus For Temporarily Bonding And Debonding Electronics Structures Relative To CarrierApr 30, 2026 · Application 19368873Pending
- Carrier For Debonding Of Bonded Stack With Passivation LayerApr 2, 2026 · Application 19348184Pending
- Method For Curing Thermosetting PolymersFeb 24, 2026 · US 12,559,601Granted
- Method And Apparatus For Debonding Temporarily Bonded Wafers In Wafer-level Packaging ApplicationsJan 22, 2026 · Application 19345705Pending
- Method And Apparatus For Thermal Processing Using Pulsed Resistance HeatingNov 20, 2025 · Application 19210818Pending
- Method For Bonding Electronics Structures During Integrated Electronics ManufacturingOct 16, 2025 · Application 19177224Pending
- Roughened Carrier for Debonding of Bonded StackSep 25, 2025 · Application 19089850Pending
- Method For Attaching And Detaching Wafers During Integrated Circuit ManufacturingSep 18, 2025 · Application 18605697Pending
- Method And Apparatus For Debonding Temporarily Bonded Wafers In Wafer-level Packaging ApplicationsJan 16, 2025 · Application 18903436Pending
- Method For Curing And Releasing Thermosetting Polymers On A Coated Glass SubstrateNov 21, 2024 · Application 18199943Pending
- Method For Integrating Semiconductor Chips On A SubstrateJun 27, 2024 · Application 18086693Pending
- Method For Attaching And Detaching Substrates During Integrated Circuit ManufacturingSep 29, 2022 · Application 17741460Pending
- Method and apparatus for debonding device substrate from carrier using resistance heatingApplication 63648518Pending
- Method For Bonding Two Wafers During Integrated Circuit ManufacturingApplication 63632537Pending
- Strobe Head Apparatus And Methods Of Assembling And Using SameApplication PCTUS2026017282Pending
- Strobe Head Apparatus and Associated MethodsApplication 63916944Pending
- Strobe Head Apparatus and Associated MethodsApplication 63765058Pending
- Method For Curing And Releasing Thermosetting Polymers On A Coated Glass SubstrateApplication PCTUS2023034035Pending
- Method For Curing Thermosetting PolymersApplication PCTUS2023033906Pending
- Methods And Apparatus For Thermal Processing Of MaterialsApplication 63705291Pending
- Method And Apparatus For Temporarily Bonding And Debonding Electronics Structures Relative To CarrierApplication PCTUS2025052491Pending
- Methods And Apparatus For Thermal Processing Of MaterialsApplication PCTUS2025050301Pending
- Wafer Debonding Using FlashlampApplication PCTUS2025043120Pending
- Method And Apparatus For Thermal Processing Using Pulsed Resistance HeatingApplication PCTUS2025029846Pending
- Method and Apparatus for Thermal Processing Using Pulsed Resistance HeatingApplication 63794150Pending
- Method For Bonding Electronics Structures During Integrated Electronics ManufacturingApplication PCTUS2025024364Pending
- Roughened Carrier For Debonding Of Bonded StackApplication PCTUS2025021318Pending
- Roughened Carrier for Debonding of Bonded StackApplication 63766681Pending
- Method and Apparatus for Temporary Bonding and Debonding Device Substrate from Carrier for Vaporization of Bonding AdhesivesApplication 63711638Pending
- Roughened Wafer Carrier for Wafer DebondingApplication 63569712Pending
- Passivation Enhanced LAL Coated Carrier for Photonic DebondingApplication 63702433Pending
- Wafer Debonding Using FlashlampApplication 63686157Pending
- Method For Attaching And Detaching Wafers During Integrated Circuit ManufacturingApplication PCTUS2024035156Pending
Related companies, and why
- Applied Bioplastics Corp.Similar federal contract value in Materials · null in contracts
- Elect Nano, LLCSimilar federal contract value in Materials · null in contracts
- DTE Materials IncSimilar federal contract value in Materials · null in contracts
- Century, Inc.Similar federal contract value in Materials · null in contracts
- INNOVATIVE WELD SOLUTIONS L.L.CSimilar federal contract value in Materials · null in contracts
- BLUESHIFT OPTICS LLCSimilar federal contract value in Materials · null in contracts
Regulatory activity · Materials
- Eliminating Regulations Establishing Fellowships in Laboratory Standardization and Testing for Foreign CitizensNational Institute of Standards and Technology
- Eliminating Obsolete Marking Requirements for Toy, Look-Alike, and Imitation FirearmsNational Institute of Standards and Technology
- Eliminating Obsolete Regulations Related to the Advanced Technology Program and the Technology Innovation ProgramNational Institute of Standards and Technology
Rules are matched to sector, not to company. Recent activity in a sector is context rather than a signal about this business — until rules are matched to what a company actually builds, the section is shown as context and nothing more.
Sources
Federal grants from SBIR/STTR, NIH, NSF and DoD records. Federal contracts from USAspending.gov. Private capital from SEC Form D. Patents from USPTO. Publications from OpenAlex. Regulatory activity from the Federal Register. Press matched on company name.
How to read this page
Figures show associations in public records, not causes or predictions. Nothing here is investment advice. An em-dash means no record was found under this company's name, not that none exists.
Data freshness
SEC Form D filings through . SBIR and STTR awards through .