Phononic Devices, Inc.
Thermoelectric cooling devices for data center networking equipment
- Sector
- Semiconductors
- Headquarters
- DURHAM, NC
- Founded
- 2008
- Latest Form D
- $44.2M, Jan 2015
- Total capital
- $68.3M
- Federal grants
- None on recordNo awards found in SBIR/STTR, NIH, NSF or DoD records.
- Private capital raised
- $68.3M
- 4 Form D · last Jan 2015
- 141 months since last filing
- Federal contracts
- None on recordNo federal contract awards found.
- Granted patents
- 12
- 28 pending · first 2014
- Rank in peer group#44 of 224
Capital timeline
Latest events
- Private capital raisedForm D · SEC · 4th filing$44.2M
- Private capital raisedForm D · SEC · 3rd filing$8.5M
- Private capital raisedForm D · SEC · 2nd filing$5.5M
- Private capital raisedForm D · SEC · 1st filing$10.1M
Node area is scaled to amount. Form D reports securities sold, which can differ from an announced round; filings are numbered in the order they were made.
Standing among 224 peers
Line = medianSemiconductors · Device
- Granted patents#44 · top 20%
Cumulative measures favor older companies. Rankings describe position today, not outcome. Below the median, ranks show as a band rather than a number.
Founders and team
From SEC Form D filings- Anthony AttiExecutive Officer, DirectorNamed in SEC Form D filings
- Anthony FadellDirectorNamed in SEC Form D filings
- Brian HinmanDirectorNamed in SEC Form D filings
- Bruce SohnDirectorNamed in SEC Form D filings
- Katherine HenryExecutive OfficerNamed in SEC Form D filings
- Matthew TrevithicDirectorNamed in SEC Form D filings
Show all 10 people
- Steve GoldbyDirectorNamed in SEC Form D filings
- Steven GoldbyDirectorNamed in SEC Form D filings
- William MortonDirectorNamed in SEC Form D filings
- Yan ZhuDirectorNamed in SEC Form D filings
What it has protected
USPTO · 12 granted of 40- GrantedMechanism For Mitigating High Heat-flux Conditions In A Thermosiphon Evaporator Or CondenserUSPTOUS 9,746,247
- GrantedHybrid Fan Assembly And Active Heating Pumping SystemUSPTOUS 9,683,752
- GrantedSystems And Methods For Operating A Thermoelectric Module To Increase EfficiencyUSPTOUS 9,593,871
Show all 40 patent records
- Mechanism For Mitigating High Heat-flux Conditions In A Thermosiphon Evaporator Or CondenserAug 29, 2017 · US 9,746,247Granted
- Hybrid Fan Assembly And Active Heating Pumping SystemJun 20, 2017 · US 9,683,752Granted
- Systems And Methods For Operating A Thermoelectric Module To Increase EfficiencyMar 14, 2017 · US 9,593,871Granted
- High-efficiency Power Conversion Architecture For Driving A Thermoelectric Cooler In Energy Conscious ApplicationsFeb 28, 2017 · US 9,581,362Granted
- Thermoelectric Heat Exchange System Comprising Cascaded Cold Side Heat SinksMay 17, 2016 · US 9,341,394Granted
- Systems And Methods To Mitigate Heat Leak Back In A Thermoelectric Refrigeration SystemApr 12, 2016 · US 9,310,111Granted
- Cascade Thermoelectric Module Configurable For Either Common Or Separate PowerMar 17, 2016 · Application 14865874Pending
- Two-phase Heat Exchanger MountingJan 12, 2016 · US 9,234,682Granted
- Low Resistivity Ohmic ContactDec 22, 2015 · US 9,218,979Granted
- Hybrid Fan Assembly And Active Heating Pumping SystemDec 10, 2015 · Application 14734119Pending
- Thermoelectric Heat Pump With A Surround And Spacer (sas) StructureSep 22, 2015 · US 9,144,180Granted
- Physically Separated Hot Side And Cold Side Heat Sinks In A Thermoelectric Refrigeration SystemAug 11, 2015 · US 9,103,572Granted
- Thermoreflectance-based Characterization Of Thermoelectric Material PropertiesApr 23, 2015 · Application 14517416Pending
- Iv-vi And Iii-v Quantum Dot Structures In A V-vi MatrixApr 23, 2015 · Application 14517345Pending
- Parallel Thermoelectric Heat Exchange SystemsMar 31, 2015 · US 8,991,194Granted
- Thermoelectric Heat Exchanger Component Including Protective Heat Spreading Lid And Optimal Thermal Interface ResistanceNov 25, 2014 · US 8,893,513Granted
- Thermoelectric Refrigeration System Control Scheme For High Efficiency PerformanceNov 7, 2013 · Application 13836525Pending
- Cartridge For Multiple Thermoelectric ModulesNov 7, 2013 · Application 13867567Pending
- Iv-vi And Iii-v Quantum Dot Structures In A V-vi MatrixApplication PCTUS2014061177Pending
- Thermoreflectance-based Characterization Of Thermoelectric Material PropertiesApplication PCTUS2014061197Pending
- Multi-powered Cascade Thermoelectric ModuleApplication 62050824Pending
- Enhanced Heat Transport Systems For Cooling Chambers And SurfacesApplication PCTUS2014055634Pending
- Heat Pipe Heat Exchanger AssemblyApplication 62027071Pending
- Adaptive Control Of Tec Device Array In 2-PHASE, Closed Loop Thermo-syphon Heat Transfer System To Optimize Device And System EfficiencyApplication 62027083Pending
- Integration Of Thermosyphon Tubing Into Accept Heat Exchanger By Embedding Into Extruded Finned Heat Sink For Refrigeration Or DehydrationApplication 62027073Pending
- Mechanism For Mitigating Heat Rejection Limitations In A Thermoelectric Driven Thermosyphon-based System Without Any Air-moving ApparatusApplication 62027080Pending
- Active Heat-pumping Fan AssemblyApplication 62009499Pending
- High-efficiency Power Conversion Architecture For Driving A Thermoelectric Heat Pump Device In Energy Conscious ApplicationsApplication 62008803Pending
- Mechanism For Mitigating High Heat-flux Conditions In A Thermosiphon Evaporator Or CondenserApplication 61932377Pending
- Low Resistivity Ohmic ContactApplication 61928113Pending
- Thermal-mechanical Package Of Thin Film Thermoelectric DeviceApplication 61896287Pending
- Iv-vi And Iii-v Quantum Dot Structures In A V-vi MatrixApplication 61894589Pending
- Thermoreflectance-based Characterization Of Thermoelectric Material PropertiesApplication 61894592Pending
- Hybrid Extend Surface, Forced Convection Boost Stage To Augment Passive Two-phase Heat Transport SystemApplication 61878156Pending
- Systems And Methods Relating To A Thermoelectric Heat Exchange SystemApplication PCTUS2013039943Pending
- Thermoelectric Heat Exchanger Component Including Protective Heat Spreading Lid And Optimal Thermal Interface ResistanceApplication PCTUS2013039945Pending
- Thermoelectric Heat Pump Cascade Using Multiple Printed Circuit Boards With Thermoelectric ModulesApplication 62472311Pending
- Low Resistivity ContactApplication PCTUS2012049428Pending
- Thermoelectric Heat Pump Cascade Using Multiple Printed Circuit Boards With Thermoelectric ModulesApplication 62469992Pending
- Solid-state Switch Architecture For Multi-mode Cooling Operation Of A Thermoelectric Heat Pump Device With A Single, Constant Dc VoltageApplication 62470003Pending
Related companies, and why
- Applied Digital Corp.Similar federal contract value in Semiconductors · null in contracts
- M/A-COM Technology Solutions Holdings, Inc.Similar federal contract value in Semiconductors · null in contracts
- AMS AGSimilar federal contract value in Semiconductors · null in contracts
- Habana LabsSimilar federal contract value in Semiconductors · null in contracts
- Movandi CorpSimilar federal contract value in Semiconductors · null in contracts
- Cornelis Networks, Inc.Similar federal contract value in Semiconductors · null in contracts
Sources
Federal grants from SBIR/STTR, NIH, NSF and DoD records. Federal contracts from USAspending.gov. Private capital from SEC Form D. Patents from USPTO. Publications from OpenAlex. Regulatory activity from the Federal Register. Press matched on company name.
How to read this page
Figures show associations in public records, not causes or predictions. Nothing here is investment advice. An em-dash means no record was found under this company's name, not that none exists.
Data freshness
SEC Form D filings through . SBIR and STTR awards through .