Lux Semiconductors Inc
System-on-Foil advanced semiconductor packaging technology for heterogeneous microelectronics integration
- Sector
- Semiconductors
- Headquarters
- Albany, NY
- Founded
- 2019
- Latest Form D
- $2.9M, Apr 2025
- Total capital
- $7.6M
- Federal grants
- $4.5M
- 6 awards · 2018–2024
- Rank in peer group#6 of 17
- Private capital raised
- $3M
- 2 Form D · last Apr 2025
- 19 months since last filing
- Federal contracts
- None on recordNo federal contract awards found.
- Granted patents
- 2
- 12 pending · first 2023
- Rank in peer group#5 of 17
Capital timeline
Latest events
- Private capital raisedForm D · SEC · 2nd filing$2.9M
- Federal grantDefense · Phase II · Advancing The Manufacturing Readiness Of Smart Substrates For System-on-foil Advanced Packaging$1.2M
- Federal grantDefense · Phase II · Modular and Conformal System-on-Foil Packaging Platform for Heterogenous Integration$1.2M
- Private capital raisedForm D · SEC · 1st filing$150K
- Federal grantDefense · Phase I · System-on-Foil Electronics for Radiation Tolerant Space Computing$50K
- Federal grantDefense · Phase II · System-on-Foil Electronics for Conformal RF Antenna Arrays$750K
- Federal grantNSF · Phase II · SBIR Phase II: Roll-to-Roll Manufacturing of Highly Crystalline Thin Film Semiconductor Substrates for Flexible Electronics$1.0M
Show 1 earlier federal award
- Federal grantNSF · Phase I · SBIR Phase I: Roll-to-Roll Manufacturing of Highly Crystalline Thin Film Semiconductor Substrates for Flexible Electronics$225K
Node area is scaled to amount. Form D reports securities sold, which can differ from an announced round; filings are numbered in the order they were made.
Federal first
43months
from Lux Semiconductors Inc’s first federal award to its first private round.
- First federal award · Jun 2018
- NSF · $225K
- First Form D · Jan 2022
- $150K · 1st Form D
- Awards before first raise
- 4 awards
An association in public records, not a cause or a prediction.
Standing among 17 peers
Line = medianSemiconductors · Material
- Federal grants#6 · top 35%
- Granted patents#5 · top 29%
Cumulative measures favor older companies. Rankings describe position today, not outcome. Below the median, ranks show as a band rather than a number.
Founders and team
Researcher links verified by same-company patents and grants- Graeme HousserResearcherExecutive OfficerLinked by $2M in grants as PI
- Shane McMahonResearcherExecutive Officer, DirectorLinked by $1.3M in grants as PI
What it has protected
USPTO · 2 granted of 14- PendingMethod Of Making Metal Substrates With Structures Formed ThereinUSPTOApplication 18798107
- GrantedMetal Substrates With Structures Formed Therein And Methods Of Making SameUSPTOUS 12,087,670
- PendingMetal Core Substrate Based Package Interconnect SystemsUSPTOApplication 18590456
Show all 14 patent records
- Method Of Making Metal Substrates With Structures Formed ThereinDec 5, 2024 · Application 18798107Pending
- Metal Substrates With Structures Formed Therein And Methods Of Making SameSep 10, 2024 · US 12,087,670Granted
- Metal Core Substrate Based Package Interconnect SystemsAug 29, 2024 · Application 18590456Pending
- Substrate-on-foil With Metal Patterned Components Formed Therein And Method Of Making The SameAug 29, 2024 · Application 18590190Pending
- Thin Film Crystallization ProcessNov 7, 2023 · US 11,810,785Granted
- Integrated Buffer And Semiconductor MaterialsMar 2, 2023 · Application 17657850Pending
- System-on-foil DeviceApplication PCTUS2020054245Pending
- Method Of Forming Metal Substrates With Structures Formed ThereinApplication PCTUS2024041613Pending
- Integrated Buffer And Semiconductor MaterialsApplication 62910076Pending
- Metal Core Substrate Based Package Interconnect SystemsApplication PCTUS2024017728Pending
- Substrate-on-foil With Metal Patterned Components Formed Therein And Method Of Making The SameApplication PCTUS2024017725Pending
- Metal Substrates With Structures Formed Therein And Methods Of Making SameApplication PCTUS2023071920Pending
- System On FoilApplication 63487345Pending
- Through Metal ViasApplication 63370812Pending
Related companies, and why
- Lux SemiconductorsShares a founder: Graeme Housser
- IMSAR LLCSimilar federal contract value in Semiconductors · null in contracts
- LUMEOVA, Inc.Similar federal contract value in Semiconductors · null in contracts
- Inpria CorpSimilar federal contract value in Semiconductors · null in contracts
- SysteMECH, Inc.Similar federal contract value in Semiconductors · null in contracts
- MicroxSimilar federal contract value in Semiconductors · null in contracts
Sources
Federal grants from SBIR/STTR, NIH, NSF and DoD records. Federal contracts from USAspending.gov. Private capital from SEC Form D. Patents from USPTO. Publications from OpenAlex. Regulatory activity from the Federal Register. Press matched on company name.
How to read this page
Figures show associations in public records, not causes or predictions. Nothing here is investment advice. An em-dash means no record was found under this company's name, not that none exists.
Data freshness
SEC Form D filings through . SBIR and STTR awards through .