Kuprion, Inc.
Metal-composite thermal management materials (carbon-fiber reinforced copper composites) for printed circuit boards, heat spreaders, and thermal vias.
- Sector
- Materials
- Headquarters
- San Jose, CA
- Total capital
- $3.5M
- Federal grants
- $2.5M
- 6 awards · 2020–2022
- Rank in peer group#72 of 84
- Private capital raised
- None on recordNo Form D filings on SEC EDGAR. Some raises are not filed.
- Federal contracts
- $975K
- 3 awards · Defense
- Rank in Materials#179 of 1258
- Granted patents
- 21
- 19 pending · first 2020
- Rank in peer group#2 of 84
Capital timeline
Latest events
- Federal contractDefense · Highly Sorptive, Non-shedding Dry Wipe For Very Rapid Cwa Decomposition$75K
- Federal contractDefense · Versatile Nanocopper-based Tim Exceeding 50% Bulk Metal Performance$750K
- Federal grantEnergy · Phase I · High Thermal Conductivity, Pitch-Based Carbon Fiber/Copper Composites$250K
- Federal grantDefense · Phase I · Broadband Protection Against Known and Novel Infectious Pathogens Through Improved Filtration Systems$50K
- Federal grantEnergy · Phase II · High Thermal Conductivity, Multi-Layer, AlN-Based PCB Enabling Rapid Prototyping with Embedded Printed Components$1.1M
- Federal grantDefense · Phase II · Power Electronics Thermal Interfaces (PETI)$750K
- Federal grantDefense · Phase I · Versatile NanoCopper-Based TIM exceeding 50% Bulk Metal Performance$150K
Show 2 earlier federal awards
- Federal grantEnergy · Phase I · High Thermal Conductivity, Multi-Layer, AlN-Based PCB Enabling Component Embedding and Rapid Prototyping$200K
- Federal contractDefense · Power Electronics Thermal Interfaces$150K
Node area is scaled to amount. Form D reports securities sold, which can differ from an announced round; filings are numbered in the order they were made.
Standing among 84 peers
Line = medianMaterials · Material
- Federal grantsBelow median
- Granted patents#2 · top 2%
Cumulative measures favor older companies. Rankings describe position today, not outcome. Below the median, ranks show as a band rather than a number.
Founders and team
No founders are linked to this company yet.
Founders appear once a person is matched to the company through its own patents, grants or filings. We never infer people from social profiles.
Checked: USPTO inventors; federal award principal investigators; SEC Form D related persons · Oct 23, 2026
Claim this profile to add your teamWhat it has protected
USPTO · 21 granted of 40- GrantedMetal-coated Substrates, Interposers, And Methods For Production ThereofUSPTOUS 12,720,675
- GrantedCeramic-based Circuit Board Assemblies Formed Using Metal NanoparticlesUSPTOUS 12,713,527
- PendingArticles Coated With Metal Nanoparticle AgglomeratesUSPTOApplication 19564329
Show all 40 patent records
- Metal-coated Substrates, Interposers, And Methods For Production ThereofAug 25, 2026 · US 12,720,675Granted
- Ceramic-based Circuit Board Assemblies Formed Using Metal NanoparticlesAug 18, 2026 · US 12,713,527Granted
- Articles Coated With Metal Nanoparticle AgglomeratesJul 16, 2026 · Application 19564329Pending
- Glass Via FillingJul 16, 2026 · Application 19022407Pending
- Protective Coverings And Dry Wipes Comprising Metal Nanoparticle Agglomerates For Infection Control Applications And Formation And Use ThereofJun 30, 2026 · US 12,667,144Granted
- Garments, Gloves And Personal Protective Equipment Enchanced With Metal Nanoparticle AgglomeratesMay 21, 2026 · Application 19448270Pending
- Articles Coated With Metal Nanoparticle AgglomeratesApr 7, 2026 · US 12,595,379Granted
- Antiseptic Applications Of Metal Nanoparticle AgglomeratesMar 26, 2026 · Application 19410273Pending
- Deformable Structures Formed From Metal Nanoparticles And Use Thereof In Heat TransferMar 12, 2026 · Application 19107931Pending
- Garments, Gloves And Personal Protective Equipment Enchanced With Metal Nanoparticle AgglomeratesFeb 10, 2026 · US 12,543,807Granted
- High Temperature Solders And Connections Formed TherefromJan 29, 2026 · Application 19341370Pending
- Antiseptic Applications Of Metal Nanoparticle AgglomeratesJan 6, 2026 · US 12,514,874Granted
- Platelet Nanoparticles, Compositions Thereof, And Formation ThereofDec 4, 2025 · Application 18875432Pending
- Thermal Management in Circuit Board AssembliesSep 23, 2025 · US 12,426,148Granted
- Air Filtration Media Having Metal Nanoparticle Agglomerates Adhered Thereto, Formation Thereof And Use ThereofJul 15, 2025 · US 12,357,932Granted
- Thermal Management in Circuit Board AssembliesJun 19, 2025 · Application 19042324Pending
- Metal-coated Substrates, Interposers, And Methods For Production ThereofJun 5, 2025 · Application 18837688Pending
- Metallized Vias In Glass And Silicon Substrates, Interposers, And Methods For Production ThereofMay 15, 2025 · Application 18837664Pending
- Electronic Assemblies Employing Copper In Multiple LocationsMay 15, 2025 · Application 19022131Pending
- Electronics Assemblies Employing Copper In Multiple LocationsFeb 18, 2025 · US 12,230,596Granted
- Heat Spreaders Featuring Coefficient Of Thermal Expansion Matching And Heat Dissipation Using SameDec 19, 2024 · Application 18706411Pending
- Heat Pipes Featuring Coefficient of Thermal Expansion Matching and Heat Dissipation Using SameOct 31, 2024 · Application 18566137Pending
- Ink Composition, Method For Forming A Conductive Member, And Conductive DeviceSep 17, 2024 · US 12,091,567Granted
- Ceramic-based Circuit Board Assemblies Formed Using Metal NanoparticlesAug 29, 2024 · Application 18657931Pending
- Ceramic-based Circuit Board Assemblies Formed Using Metal NanoparticlesJun 18, 2024 · US 12,016,118Granted
- Biofilm-Resistant Articles Coated with Metal Nanoparticle AgglomeratesMay 16, 2024 · Application 18281850Pending
- Thermal Management In Circuit Board AssembliesFeb 20, 2024 · US 11,910,520Granted
- Electronics Assemblies Employing Copper In Multiple LocationsAug 22, 2023 · US 11,735,548Granted
- Spray Formulations Comprising Metal Nanoparticle Agglomerates And Surface Disinfection TherewithJun 8, 2023 · Application 17995487Pending
- Thermal Management In Circuit Board AssembliesNov 15, 2022 · US 11,503,700Granted
- Method Of Interconnecting Nanowires, Nanowire Network And Transparent Conductive ElectrodeAug 16, 2022 · US 11,417,441Granted
- Ink Composition, Method For Forming A Conductive Member, And Conductive DeviceMar 15, 2022 · US 11,274,224Granted
- Metal Nanoparticles Formed Around A Nucleus and Scalable Processes for Producing SameOct 12, 2021 · US 11,141,785Granted
- Copper Nanoparticle Application Processes For Low Temperature Printable, Flexible/conformal Electronics And AntennasJun 30, 2020 · US 10,701,804Granted
- Method Of Interconnecting Nanowires And Transparent Conductive ElectrodeJun 23, 2020 · US 10,692,621Granted
- Thermal Management In Circuit Board AssembliesApr 7, 2020 · US 10,616,994Granted
- Metal Nanoparticles Formed Around A Nucleus And Scalable Processes For Producing SameFeb 25, 2020 · US 10,569,329Granted
- Ceramic-based Circuit Board Assemblies Formed Using Metal NanoparticlesApplication PCTUS2021019878Pending
- Metal-coated Substrates, Interposers, And Methods For Production ThereofApplication PCTUS2023062673Pending
- Antiseptic Applications Of Metal NanoparticlesApplication 63060739Pending
Related companies, and why
- NUBURU INC.Similar federal contract value in Materials · $1M in contracts
- Kubota Research AssociatesSimilar federal contract value in Materials · $998K in contracts
- ADDITIVE MANUFACTURING INNOVATIONS LLCSimilar federal contract value in Materials · $990K in contracts
- VISTA ENGINEERING AND CONSULTING, LLCSimilar federal contract value in Materials · $950K in contracts
- Open Additive, LLCSimilar federal contract value in Materials · $919K in contracts
- Norcon Technologies, LLCSimilar federal contract value in Materials · $900K in contracts
Regulatory activity · Materials
- Eliminating Regulations Establishing Fellowships in Laboratory Standardization and Testing for Foreign CitizensNational Institute of Standards and Technology
- Eliminating Obsolete Marking Requirements for Toy, Look-Alike, and Imitation FirearmsNational Institute of Standards and Technology
- Eliminating Obsolete Regulations Related to the Advanced Technology Program and the Technology Innovation ProgramNational Institute of Standards and Technology
Rules are matched to sector, not to company. Recent activity in a sector is context rather than a signal about this business — until rules are matched to what a company actually builds, the section is shown as context and nothing more.
Sources
Federal grants from SBIR/STTR, NIH, NSF and DoD records. Federal contracts from USAspending.gov. Private capital from SEC Form D. Patents from USPTO. Publications from OpenAlex. Regulatory activity from the Federal Register. Press matched on company name.
How to read this page
Figures show associations in public records, not causes or predictions. Nothing here is investment advice. An em-dash means no record was found under this company's name, not that none exists.
Data freshness
SEC Form D filings through . SBIR and STTR awards through .