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JETCOOL TECHNOLOGIES INC

Littleton, MA · Founded 2019 · Semiconductors · Acquired

Direct-to-chip liquid cooling systems for high-performance computing infrastructure

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Updated · jetcool.com

Sector
Semiconductors
Headquarters
Littleton, MA
Founded
2019
Latest Form D
$7.3M, Oct 2022
Total capital
$13.9M
Federal grants
$2.1M
4 awards · 2019–2023
Rank in peer group#58 of 58
Private capital raised
$11.7M
3 Form D · last Oct 2022
46 months since last filing
Federal contracts
$49K
1 award · Defense
Rank in Semiconductors#168 of 706
Granted patents
6
19 pending · first 2024
Rank in peer group#8 of 58

Capital timeline

20192020202120222023FEDERAL ↑EQUITY ↓Cumulative $13.9M$49K$985K$49K$139K$970K1st Form D$1.2M2nd Form D$3.3M3rd Form D$7.3M
20192020202120222023FEDERAL ↑EQUITY ↓Cumulative $13.9M$985K$49K$139K$970K1st Form D$1.2M2nd Form D$3.3M3rd Form D$7.3M

Latest events

  • Federal grantEnergy · Phase II · Sub-One PUE through Silicon Cooling Efficiency$970K
  • Private capital raisedForm D · SEC · 3rd filing$7.3M
  • Private capital raisedForm D · SEC · 2nd filing$3.3M
  • Federal grantDefense · Phase I · Lightweight Power Converter Cooling with Enhanced EMI Characteristics$139K
  • Federal contractDefense · Fan-less Cooling For Compute At The Tactical Edge$49K
  • Federal grantDefense · Phase II · Ultra-Compact Microconvective Chill Plates for Electronics Cooling$985K
  • Private capital raisedForm D · SEC · 1st filing$1.2M
Show 1 earlier federal award
  • Federal grantDefense · Phase I · Ultra-Compact Microconvective Chill Plates for Electronics Cooling$49K

Node area is scaled to amount. Form D reports securities sold, which can differ from an announced round; filings are numbered in the order they were made.

Federal first

2months

from JETCOOL TECHNOLOGIES INC’s first federal award to its first private round.

First federal award · Dec 2019
Defense · $49K
First Form D · Feb 2020
$1.2M · 1st Form D
Awards before first raise
1 award

An association in public records, not a cause or a prediction.

Standing among 58 peers

Line = median

Semiconductors · Device

  • Federal grantsBelow median
  • Granted patents#8 · top 14%

Cumulative measures favor older companies. Rankings describe position today, not outcome. Below the median, ranks show as a band rather than a number.

Founders and team

Researcher links verified by same-company patents and grants
  • Bernard MalouinResearcherExecutive Officer, DirectorLinked by 5 patents · $1.2M in grants as PI
  • Adam JacksonDirectorNamed in SEC Form D filings
  • Alexandra ManickDirectorNamed in SEC Form D filings
  • Bernard Malouin Jr.Executive Officer, DirectorNamed in SEC Form D filings
  • David AndonianDirectorNamed in SEC Form D filings
  • Lawrence FishDirectorNamed in SEC Form D filings

What it has protected

USPTO · 6 granted of 25
  • PendingActively Cooled Heat-Dissipation Lids for Computer Processors and Processor AssembliesUSPTOApplication 19204870
  • GrantedCooling Module With Integrated Pump for Immersion Cooling in ElectronicsUSPTOUS 12,563,707
  • PendingCooling Module With Improved Flow Balancing, Jet-Height Control, and Wash-Out MitigationUSPTOApplication 19297606
Show all 25 patent records
  • Actively Cooled Heat-Dissipation Lids for Computer Processors and Processor AssembliesMar 26, 2026 · Application 19204870Pending
  • Cooling Module With Integrated Pump for Immersion Cooling in ElectronicsFeb 24, 2026 · US 12,563,707Granted
  • Cooling Module With Improved Flow Balancing, Jet-Height Control, and Wash-Out MitigationFeb 12, 2026 · Application 19297606Pending
  • Bleed-in Reservoir For Improved All-In-One (AIO) System Longevity and PerformanceFeb 12, 2026 · Application 19292325Pending
  • Internal Recirculation Cooling ModuleOct 16, 2025 · Application 19247680Pending
  • Internal Recirculation Cooling ModuleSep 30, 2025 · US 12,432,878Granted
  • Reservoir with Flow Tunnel for All-In-One Cooling SystemsAug 7, 2025 · Application 18430167Pending
  • Actively Cooled Heat-Dissipation Lids for Computer Processors and Processor AssembliesJun 3, 2025 · US 12,324,126Granted
  • Liquid-In-Liquid Cooling System for Electronic ComponentsApr 29, 2025 · US 12,289,861Granted
  • High Temperature Electronic Device Thermal Management SystemApr 29, 2025 · US 12,289,871Granted
  • Direct Contact Fluid Based Cooling ModuleFeb 13, 2025 · Application 18613449Pending
  • Actively Cooled Heat-Dissipation Lids for Computer Processors and AssembliesJun 18, 2024 · US 12,016,157Granted
  • Ship-and-Install Electronics Assembly with Multifunctional Interface Chassis and Liquid-Fluid Heat ExchangeSep 7, 2023 · Application 18116617Pending
  • Bleed-in Reservoir For Improved All-In-One (AIO) System Longevity and PerformanceApplication 63679987Pending
  • Cooling Module with Improved Flow Balancing and Washout MitigationApplication 63682142Pending
  • High Temperature Electronic Device Thermal Management SystemApplication PCTUS2024048973Pending
  • Area-enhanced Cooling Module And Electronic Assembly With Microjet Capture ManifoldApplication PCTUS2025034806Pending
  • Cooling Module With Integrated Pump For Immersion Cooling In ElectronicsApplication PCTUS2023035768Pending
  • Direct Contact Fluid Based Cooling ModuleApplication 18232536Pending
  • Method and Apparatus for Internal Coolant Recirculation and Cooling Performance EnhancementApplication 63527517Pending
  • Actively Cooled Heat-dissipation Lids For Computer Processors And Processor AssembliesApplication PCTUS2023014317Pending
  • All-in-one Liquid Cooling System With A Bleed-in ReservoirApplication PCTUS2025040917Pending
  • Captive Jet Enhanced Impingement Cooling ModuleApplication 63663631Pending
  • Liquid-in-liquid Cooling System For Electronic ComponentsApplication PCTUS2022049513Pending
  • Internal Recirculation Cooling ModuleApplication PCTUS2024038605Pending

Related companies, and why

Sources

Federal grants from SBIR/STTR, NIH, NSF and DoD records. Federal contracts from USAspending.gov. Private capital from SEC Form D. Patents from USPTO. Publications from OpenAlex. Regulatory activity from the Federal Register. Press matched on company name.

How to read this page

Figures show associations in public records, not causes or predictions. Nothing here is investment advice. An em-dash means no record was found under this company's name, not that none exists.

Data freshness

SEC Form D filings through . SBIR and STTR awards through .