Intrinsiq Materials, Inc.
Customized electronic inks and pastes for printed electronics
- Sector
- Materials
- Headquarters
- ROCHESTER, NY
- Latest Form D
- $3M, Aug 2016
- Total capital
- $7.1M
- Federal grants
- None on recordNo awards found in SBIR/STTR, NIH, NSF or DoD records.
- Private capital raised
- $7.1M
- 2 Form D · last Aug 2016
- 122 months since last filing
- Federal contracts
- None on recordNo federal contract awards found.
- Granted patents
- 1
- 4 pending · first 2018
- Rank in peer group#83 of 369
Capital timeline
Latest events
- Private capital raisedForm D · SEC · 2nd filing$3M
- Private capital raisedForm D · SEC · 1st filing$4.1M
Node area is scaled to amount. Form D reports securities sold, which can differ from an announced round; filings are numbered in the order they were made.
Standing among 369 peers
Line = medianMaterials · Material
- Granted patents#83 · top 22%
Cumulative measures favor older companies. Rankings describe position today, not outcome. Below the median, ranks show as a band rather than a number.
Founders and team
From SEC Form D filings- Robert F. CournoyerExecutive Officer, DirectorNamed in SEC Form D filings
- Robert L NeadExecutive Officer, DirectorNamed in SEC Form D filings
What it has protected
USPTO · 1 granted of 5- GrantedMethod For Forming Vias On Printed Circuit BoardsUSPTOUS 9,999,137
- PendingMethod For Depositing And Curing Nanoparticle-based InkUSPTOApplication 14568168
- PendingConductive Paste Formulations For Improving Adhesion To Plastic SubstratesUSPTOApplication 14219087
Show all 5 patent records
- Method For Forming Vias On Printed Circuit BoardsJun 12, 2018 · US 9,999,137Granted
- Method For Depositing And Curing Nanoparticle-based InkJul 2, 2015 · Application 14568168Pending
- Conductive Paste Formulations For Improving Adhesion To Plastic SubstratesSep 25, 2014 · Application 14219087Pending
- Performance Of Conductive Copper Paste Using Copper FlakeSep 25, 2014 · Application 14219047Pending
- Surface Conditioning For Depositing And Curing Nanoparticle-based InkMar 6, 2014 · Application 13963124Pending
Related companies, and why
- Partanna Global, Inc.Similar federal contract value in Materials · null in contracts
- BioLogiQ, Inc.Similar federal contract value in Materials · null in contracts
- Tectonic Audio Labs Inc.Similar federal contract value in Materials · null in contracts
- Oceanix USA Inc.Similar federal contract value in Materials · null in contracts
- Cocoon Biotech Inc.Similar federal contract value in Materials · null in contracts
- INTEMATIX CorpSimilar federal contract value in Materials · null in contracts
Regulatory activity · Materials
- Eliminating Regulations Establishing Fellowships in Laboratory Standardization and Testing for Foreign CitizensNational Institute of Standards and Technology
- Eliminating Obsolete Marking Requirements for Toy, Look-Alike, and Imitation FirearmsNational Institute of Standards and Technology
- Eliminating Obsolete Regulations Related to the Advanced Technology Program and the Technology Innovation ProgramNational Institute of Standards and Technology
Rules are matched to sector, not to company. Recent activity in a sector is context rather than a signal about this business — until rules are matched to what a company actually builds, the section is shown as context and nothing more.
Sources
Federal grants from SBIR/STTR, NIH, NSF and DoD records. Federal contracts from USAspending.gov. Private capital from SEC Form D. Patents from USPTO. Publications from OpenAlex. Regulatory activity from the Federal Register. Press matched on company name.
How to read this page
Figures show associations in public records, not causes or predictions. Nothing here is investment advice. An em-dash means no record was found under this company's name, not that none exists.
Data freshness
SEC Form D filings through . SBIR and STTR awards through .