INDIANA INTEGRATED CIRCUITS LLC
Cryogenic CMOS analog and digital circuits including adiabatic ALU, energy-recover RAM, RF generator, transimpedance amplifier, and DAC for quantum computing control
- Sector
- Semiconductors
- Headquarters
- South Bend, IN
- Latest Form D
- $455K, Jul 2015
- Total capital
- $2.3M
- Federal grants
- $417K
- 3 awards · 2017–2021
- Rank in peer group#30 of 49
- Private capital raised
- $455K
- 1 Form D · last Jul 2015
- 136 months since last filing
- Federal contracts
- $1.4M
- 5 awards · NASA, Defense
- Rank in Semiconductors#111 of 707
- Granted patents
- 11
- 9 pending · first 2017
- Rank in peer group#4 of 49
Capital timeline
Latest events
- Federal grantNASA · Phase I · PCB "Boardlets" for Modular, Scalable High-Performance Printed Circuit Assemblies"$117K
- Federal grantDefense · Phase I · Cryogenic Adiabatic CMOS for Ultra-Low Power Circuits$150K
- Federal contractDefense · Adiabatic Circuits For Ultra-low Energy Consumption$850K
- Federal contractDefense · In Support Of Adiabatic Circuits For Ultra-low Energy Consumption.$146K
- Federal grantEnergy · Phase I · Enabling Large Format Deep Pixel Detectors Through 3D Quilt Packaging$150K
- Private capital raisedForm D · SEC · 1st filing$455K
- Federal contractNASA · Igf::ot::igf Indiana Integrated Circuits, Llc (iic) Proposes To Develop The Customizable, High-performance Microchip Interconnect Technology Called Quilt Packaging (qp) To Address Nasa's Requirement For High Performance Integration Of Heterogeneous Microwave Systems. Qp Is An Affordable, Scalable, Patented Edge-interconnect Technology For Joining Microchips Of Disparate Materials And/or Process Technologies Into Monolithic-like Systems That Perform Electrically As If They Were One Chip. Qp Enabl$125K
Show 2 earlier federal awards
- Federal contractDefense · Igf::ot::igf SBIR I - Advanced Chip Integration For Enhanced Arrays$150K
- Federal contractNASA · Pcb "boardlets" For Modular, Scalable High-performance Printed Circuit Assemblies"$117K
Node area is scaled to amount. Form D reports securities sold, which can differ from an announced round; filings are numbered in the order they were made.
Federal first
50months
from INDIANA INTEGRATED CIRCUITS LLC’s first federal award to its first private round.
- First federal award · May 2011
- NASA · $117K
- First Form D · Jul 2015
- $455K · 1st Form D
- Awards before first raise
- 3 awards
An association in public records, not a cause or a prediction.
Standing among 49 peers
Line = medianSemiconductors · Device
- Federal grantsBelow median
- Granted patents#4 · top 8%
Cumulative measures favor older companies. Rankings describe position today, not outcome. Below the median, ranks show as a band rather than a number.
Founders and team
Researcher links verified by same-company patents and grants- Jason M. KulickResearcherExecutive Officer, DirectorLinked by 9 patents · $117K in grants as PI
- Alan A. IsaacsonExecutive OfficerNamed in SEC Form D filings
- Dale A. O'ChapExecutive OfficerNamed in SEC Form D filings
What it has protected
USPTO · 11 granted of 20- GrantedEdge Interconnects for Use with Circuit Boards and Integrated CircuitsUSPTOUS 11,658,432
- GrantedAssembling and Handling Edge Interconnect Packaging SystemUSPTOUS 11,523,511
- PendingThree-Dimensional Printed Circuit Substrate AssemblyUSPTOApplication 17713595
Show all 20 patent records
- Edge Interconnects for Use with Circuit Boards and Integrated CircuitsMay 23, 2023 · US 11,658,432Granted
- Assembling and Handling Edge Interconnect Packaging SystemDec 6, 2022 · US 11,523,511Granted
- Three-Dimensional Printed Circuit Substrate AssemblyOct 6, 2022 · Application 17713595Pending
- Edge Interconnect Self-Assembly SubstrateJul 26, 2022 · US 11,398,463Granted
- Assembling and Handling Edge Interconnect Packaging SystemMar 9, 2021 · US 10,945,335Granted
- Edge Interconnect Self-Assembly SubstrateJan 19, 2021 · US 10,896,898Granted
- Inter-Chip AlignmentSep 10, 2019 · US 10,410,989Granted
- Edge Interconnect Packaging Of Integrated Circuits For Power SystemsJun 18, 2019 · US 10,325,875Granted
- Substrates with Interdigitated Hinged Edge InterconnectsJan 15, 2019 · US 10,182,498Granted
- Prototyping of Electronic Circuits with Edge InterconnectsAug 21, 2018 · US 10,056,335Granted
- Method of Interconnecting MicrochipsDec 12, 2017 · US 9,844,139Granted
- Prototyping of Electronic Circuits with Edge InterconnectsOct 31, 2017 · US 9,806,030Granted
- Edge Interconnects for Use with Circuit Boards and Integrated CircuitsApplication 62966777Pending
- 3-D Quilt Package ArrayApplication 63170641Pending
- Fast Prototyping of IC's with Edge InterconnectsApplication 62247457Pending
- Edge Inteconnect Self-Assembly SubstrateApplication 62247439Pending
- Substrates with Interdigitated Hinged Edge InterconnectsApplication 62247477Pending
- Edge Interconnect Packaging Of Integrated Circuits For Power SystemsApplication PCTUS2015040862Pending
- Edge Interconnects for Use with Circuit Boards and Integrated CircuitsApplication 62790713Pending
- Energy Recovery Adiabatic Flip-flop And Resonator Based Bennett Clock GeneratorApplication PCTUS2023025854Pending
Related companies, and why
- APPLIED NOVEL DEVICES, INC.Similar federal contract value in Semiconductors · $1.4M in contracts
- JP Analytical LLCSimilar federal contract value in Semiconductors · $1.4M in contracts
- XCELERIUM INCSimilar federal contract value in Semiconductors · $1.4M in contracts
- Finwave Semiconductor, Inc.Similar federal contract value in Semiconductors · $1.3M in contracts
- NESS ENGINEERING, INC.Similar federal contract value in Semiconductors · $1.3M in contracts
- NONLINEAR CONTROL STRATEGIES, INC.Similar federal contract value in Semiconductors · $1.3M in contracts
Sources
Federal grants from SBIR/STTR, NIH, NSF and DoD records. Federal contracts from USAspending.gov. Private capital from SEC Form D. Patents from USPTO. Publications from OpenAlex. Regulatory activity from the Federal Register. Press matched on company name.
How to read this page
Figures show associations in public records, not causes or predictions. Nothing here is investment advice. An em-dash means no record was found under this company's name, not that none exists.
Data freshness
SEC Form D filings through . SBIR and STTR awards through .