Hyperlume
Optical photonic interconnects for data centers that replace copper wiring
- Sector
- Semiconductors
- Headquarters
- OTTAWA, A6
- Founded
- 2022
- Latest Form D
- $2.3M, Jan 2025
- Total capital
- $2.3M
- Federal grants
- None on recordNo awards found in SBIR/STTR, NIH, NSF or DoD records.
- Private capital raised
- $2.3M
- 1 Form D · last Jan 2025
- 22 months since last filing
- Federal contracts
- None on recordNo federal contract awards found.
- Granted patents
- 0
- 13 pending
Capital timeline
Latest events
- Private capital raisedForm D · SEC · 1st filing$2.3M
Node area is scaled to amount. Form D reports securities sold, which can differ from an announced round; filings are numbered in the order they were made.
Founders and team
From SEC Form D filings- Charles LesperanceDirectorNamed in SEC Form D filings
- Hossein FariborziExecutive Officer, DirectorNamed in SEC Form D filings
- Mohsen AsadExecutive Officer, DirectorNamed in SEC Form D filings
What it has protected
USPTO · 0 granted of 13- PendingMicro-led Display Co-packaged With Optics And Method Of FabricationUSPTOApplication 18711591
- PendingInterdigitated Fingered-type Spatially Modulated Photodetector With Extra Biasing For Carrier Acceleration In Visible Light CommunicationUSPTOApplication 19054826
- PendingLow Power Micro-led Driver For High Bandwidth Short Distance CommunicationUSPTOApplication 19054877
Show all 13 patent records
- Micro-led Display Co-packaged With Optics And Method Of FabricationJun 18, 2026 · Application 18711591Pending
- Interdigitated Fingered-type Spatially Modulated Photodetector With Extra Biasing For Carrier Acceleration In Visible Light CommunicationMay 7, 2026 · Application 19054826Pending
- Low Power Micro-led Driver For High Bandwidth Short Distance CommunicationMay 7, 2026 · Application 19054877Pending
- Plasmonic Micro-leds For High Speed CommunicationMay 7, 2026 · Application 19060690Pending
- Optical Link With Redundant Light Source And Method Of CouplingMay 7, 2026 · Application 19060702Pending
- Cubic Gan Semiconductor Device Manufacturing MethodsMar 5, 2026 · Application 19054863Pending
- Active Optical Interconnect With Multiple Light Sources And Method Of ModulationMar 5, 2026 · Application 19066153Pending
- Optical Interconnect Design For Active Short Distance LinksMar 5, 2026 · Application 19055093Pending
- Cmos Photodiode Using Nmos And Pmos Transistors For Visible Light CommunicationMar 5, 2026 · Application 19054859Pending
- Multi-layer Micro-led Display And Method Of Fabrication For Panel Level IntegrationDec 4, 2025 · Application 18707685Pending
- Optical Chip-to-Chip Interconnect and Method of IntegrationJul 3, 2025 · Application 19064694Pending
- Method Of Packaging And Integration For Multi-layer SystemMay 22, 2025 · Application 19023655Pending
- Multi-layer Micro-led Display And Method Of Fabrication For Panel Level IntegrationApplication PCTUS2022048990Pending
Related companies, and why
- ARIL COMPUTER CORPSimilar federal contract value in Semiconductors · null in contracts
- METAWAVE CORPSimilar federal contract value in Semiconductors · null in contracts
- TELLURIC LABS LLCSimilar federal contract value in Semiconductors · null in contracts
- EOS PhotonicsSimilar federal contract value in Semiconductors · null in contracts
- AheadComputing, Inc.Similar federal contract value in Semiconductors · null in contracts
- RASEC TECHNOLOGIES, LLCSimilar federal contract value in Semiconductors · null in contracts
Sources
Federal grants from SBIR/STTR, NIH, NSF and DoD records. Federal contracts from USAspending.gov. Private capital from SEC Form D. Patents from USPTO. Publications from OpenAlex. Regulatory activity from the Federal Register. Press matched on company name.
How to read this page
Figures show associations in public records, not causes or predictions. Nothing here is investment advice. An em-dash means no record was found under this company's name, not that none exists.
Data freshness
SEC Form D filings through . SBIR and STTR awards through .