GEMINATIO INC.

Semiconductors · Private

Photoresist and semiconductor overcoat materials enabling sub-60 nm feature patterning on existing 193 nm lithography equipment

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Updated Oct 23, 2026

Sector: Semiconductors
Total capital: $1.5M

Federal grants: $1.5M; 2 awards · 2023–2025; Rank in peer group#12 of 15
Private capital raised: None on recordNo Form D filings on SEC EDGAR. Some raises are not filed.
Federal contracts: None on recordNo federal contract awards found.
Granted patents: 3; 37 pending · first 2025; Rank in peer group#7 of 15

Capital timeline

Latest events

Jul 2025Federal grantNSF · Phase II · SBIR Phase II: Liquid-Enabled Advanced Pitch (LEAP) Semiconductor Manufacturing$1.3M
Jul 2023Federal grantNSF · Phase I · SBIR Phase I:Liquid-Enabled Advanced Pitch (LEAP) Semiconductor Manufacturing$275K

Node area is scaled to amount. Form D reports securities sold, which can differ from an announced round; filings are numbered in the order they were made.

Standing among 15 peers

Line = median

Semiconductors · Material

Federal grantsBelow median
Granted patents#7 · top 47%

Cumulative measures favor older companies. Rankings describe position today, not outcome. Below the median, ranks show as a band rather than a number.

Founders and team

No founders are linked to this company yet.

Founders appear once a person is matched to the company through its own patents, grants or filings. We never infer people from social profiles.

Checked: USPTO inventors; federal award principal investigators; SEC Form D related persons · Oct 23, 2026

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What it has protected

USPTO · 3 granted of 40

Aug 25, 2026GrantedGeneration Of Multiline Etch SubstratesUSPTOUS 12,721,060
Feb 10, 2026GrantedSelf-aligned Build-up ProcessingUSPTOUS 12,547,072
Oct 9, 2025PendingSelf-aligned Double Patterning Using Metal-based ResistUSPTOApplication 19097643

Show all 40 patent records

Generation Of Multiline Etch SubstratesAug 25, 2026 · US 12,721,060Granted
Self-aligned Build-up ProcessingFeb 10, 2026 · US 12,547,072Granted
Self-aligned Double Patterning Using Metal-based ResistOct 9, 2025 · Application 19097643Pending
Overcoat Composition And Patterning MethodsOct 9, 2025 · Application 19097630Pending
Self-aligned Double Patterning Using Metal-based ResistOct 9, 2025 · Application 19097676Pending
In-resist Process For High Density Contact FormationAug 12, 2025 · US 12,386,261Granted
Multi-level Selective Patterning For Stacked Device CreationJul 17, 2025 · Application 18705407Pending
Masking Process Using Switchable PolymerJul 3, 2025 · Application 18988498Pending
Optimization For Local Chemical ExposureApr 24, 2025 · Application 18686832Pending
Narrow Line Cut Masking ProcessApr 24, 2025 · Application 18686838Pending
Enhanced Field Stitching With Corrective ChemistryApr 24, 2025 · Application 18686796Pending
Generation Of Multiline Etch SubstratesApr 24, 2025 · Application 18686826Pending
Anti-spacer Based Self-aligned High Order PatterningFeb 27, 2025 · Application 18686819Pending
Chemically Selective Adhesion And Strength Promoters In Semiconductor PatterningDec 19, 2024 · Application 18705427Pending
Assisted Feature Placement In Semiconductor PatterningNov 14, 2024 · Application 18686814Pending
Local Shadow Masking For Multi-color ExposuresNov 14, 2024 · Application 18696593Pending
Enhanced Field Stitching With Corrective ChemistryApplication PCTUS2022041567Pending
In-resist Process For High Density Contact FormationApplication PCTUS2022041533Pending
Generation Of Multiline Etch SubstratesApplication PCTUS2022041546Pending
Narrow Line Cut Masking ProcessApplication PCTUS2022041545Pending
Optimization For Local Chemical ExposureApplication PCTUS2022041514Pending
Anti-spacer Based Self-aligned High Order PatterningApplication PCTUS2022041550Pending
Multi-Level Selective Patterning for Stacked Device CreationApplication 63271877Pending
Optimization for Local Chemical ExposureApplication 63236847Pending
In-Resist Process for High Density Contact FormationApplication 63236832Pending
Anti-spacer Process Using Dry DevelopmentApplication 63638765Pending
Narrow Line Cut Masking ProcessApplication 63631164Pending
Materials And Methods For Self-aligned Double PatterningApplication 63631155Pending
Materials And Methods For Self-aligned Double PatterningApplication 63631317Pending
Simplified Narrow Line Cut Masking ProcessApplication 63616080Pending
Materials And Methods For Self-aligned Double PatterningApplication 63616086Pending
Narrow Line Cut Masking ProcessApplication 63616068Pending
Narrow Line Cut Masking Process Using Switchable PolymerApplication 63616077Pending
Narrow Line Cut Masking Process Using Switchable PolymerApplication 63616073Pending
Local Shadow Masking For Multi-color ExposuresApplication PCTUS2022047662Pending
Generation of Multicolor Etch SubstratesApplication 63236850Pending
Multi-level Selective Patterning For Stacked Device CreationApplication PCTUS2022047704Pending
Chemically Selective Adhesion And Strength Promoters In Semiconductor PatterningApplication PCTUS2022047667Pending
Self-aligned Build-up ProcessingApplication PCTUS2022041548Pending
Assisted Feature Placement In Semiconductor PatterningApplication PCTUS2022041554Pending

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8D PHOTONICS LLCSimilar federal contract value in Semiconductors · null in contracts
OptiPulse, IncSimilar federal contract value in Semiconductors · null in contracts
NOUVAI INC.Similar federal contract value in Semiconductors · null in contracts

Sources

Federal grants from SBIR/STTR, NIH, NSF and DoD records. Federal contracts from USAspending.gov. Private capital from SEC Form D. Patents from USPTO. Publications from OpenAlex. Regulatory activity from the Federal Register. Press matched on company name.

How to read this page

Figures show associations in public records, not causes or predictions. Nothing here is investment advice. An em-dash means no record was found under this company's name, not that none exists.

Data freshness

SEC Form D filings through Oct 23, 2026. SBIR and STTR awards through Oct 21, 2026.