ACTIVE LAYER PARAMETRICS, INC.
Electrical characterization tool for measuring resistivity depth profiles in 3D semiconductor structures with nanometer-scale resolution
- Sector
- Semiconductors
- Headquarters
- Scotts Valley, CA
- Total capital
- $1.1M
- Federal grants
- $1.1M
- 3 awards · 2015–2019
- Rank in peer group#11 of 36
- Private capital raised
- None on recordNo Form D filings on SEC EDGAR. Some raises are not filed.
- Federal contracts
- None on recordNo federal contract awards found.
- Granted patents
- 4
- 5 pending · first 2020
- Rank in peer group#6 of 36
Capital timeline
Latest events
- Federal grantNSF · Phase I · SBIR Phase I: Differential resistance method to profile 3D semiconductor structures$225K
- Federal grantNSF · Phase II · SBIR Phase II: Activation and Mobility Profiling for High-mobility Semiconductor Materials$750K
- Federal grantNSF · Phase I · SBIR Phase I: Activation and Mobility Profiling for III-V Semiconductor Materials$150K
Node area is scaled to amount. Form D reports securities sold, which can differ from an announced round; filings are numbered in the order they were made.
Standing among 36 peers
Line = medianSemiconductors · Instrument
- Federal grants#11 · top 31%
- Granted patents#6 · top 17%
Cumulative measures favor older companies. Rankings describe position today, not outcome. Below the median, ranks show as a band rather than a number.
Founders and team
No founders are linked to this company yet.
Founders appear once a person is matched to the company through its own patents, grants or filings. We never infer people from social profiles.
Checked: USPTO inventors; federal award principal investigators; SEC Form D related persons · Oct 23, 2026
Claim this profile to add your teamWhat it has protected
USPTO · 4 granted of 9- PendingMethods For Electrical Property Depth Profiling Through Films With Graded CompositionUSPTOApplication 18759553
- GrantedMethods And Tools For Electrical Property Depth Profiling Using Electro-etchingUSPTOUS 12,313,669
- GrantedMethods And Apparatus For Test Pattern Forming And Film Property MeasurementUSPTOUS 11,699,622
Show all 9 patent records
- Methods For Electrical Property Depth Profiling Through Films With Graded CompositionJan 1, 2026 · Application 18759553Pending
- Methods And Tools For Electrical Property Depth Profiling Using Electro-etchingMay 27, 2025 · US 12,313,669Granted
- Methods And Apparatus For Test Pattern Forming And Film Property MeasurementJul 11, 2023 · US 11,699,622Granted
- Methods And Apparatus For Test Pattern Forming And Film Property MeasurementMar 29, 2022 · US 11,289,386Granted
- Methods And Systems For Material Property Profiling Of Thin FilmsSep 29, 2020 · US 10,790,203Granted
- Thin Film Property Profiling Methods And ApparatusApplication 62458500Pending
- Methods and apparatus for test pattern forming and film property measurementApplication 62819518Pending
- Methods And Systems For Material Property Profiling Of Thin FilmsApplication PCTUS2017029424Pending
- Methods And Apparatus For Depth Profiling Of Thin Layer PropertiesApplication 62458490Pending
Related companies, and why
- Revolution Computing IncorporatedSimilar federal contract value in Semiconductors · null in contracts
- PIVOTAL COMMWARE, INC.Similar federal contract value in Semiconductors · null in contracts
- LUXIM CORPSimilar federal contract value in Semiconductors · null in contracts
- ALIGNED CARBON INC.Similar federal contract value in Semiconductors · null in contracts
- AKROS SILICON INCSimilar federal contract value in Semiconductors · null in contracts
- FREESCALE LLCSimilar federal contract value in Semiconductors · null in contracts
Sources
Federal grants from SBIR/STTR, NIH, NSF and DoD records. Federal contracts from USAspending.gov. Private capital from SEC Form D. Patents from USPTO. Publications from OpenAlex. Regulatory activity from the Federal Register. Press matched on company name.
How to read this page
Figures show associations in public records, not causes or predictions. Nothing here is investment advice. An em-dash means no record was found under this company's name, not that none exists.
Data freshness
SEC Form D filings through . SBIR and STTR awards through .